- 您现在的位置：买卖IC网 > Datasheet目录222 > DS1963S-F5+ (Maxim Integrated)IBUTTON MONETARY SHA-1 Datasheet资料下载
参数资料
| 型号： | DS1963S-F5+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/4页 |
| 文件大小： | 0K |
| 描述： | IBUTTON MONETARY SHA-1 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| RoHS指令信息： | IButton RoHS Compliance Plan |
| 标准包装： | 18 |
| 系列： | iButton® |
| 存储容量： | 512B |
| 存储器类型： | NVSRAM（非易失 SRAM） |
| 产品目录页面： | 1431 (CN2011-ZH PDF) |
Conclusion:
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor products and processes:
DS1963S
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing
product will continue to meet Maxim's quality and reliability standards. The current status of the
reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.*
Module Description:
A description of this Module can be found in the product data sheet. You can find the product data
sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.*
Reliability Derating:
A module device consists of one or more IC's in a single, upward integrated, package. This
package is assembled to include batteries, crystals, and other piece parts that make up the
configuration of the Module. Because of either the complexity of the package or the included piece
parts, standard high temperature reliability testing is not possible. Therefore, in order to determine
the reliability of module products, the reliability of each of the piece parts is individually determined,
then summed to determine the reliability of the integrated module product. If there are "n" significant
components in the module then:
Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n)
Fr (module) = Failure rate of module
Fr(n) = Failure rate of the nth component
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
The calculated failure rate for this module/assembly is:
Module Device:
DS2421
Totals:
Quantity:
1
MTTF (Yrs):
20404
20404
FITs:
5.6
6
The parameters used to calculate the module failure rate are as follows:
Cf: 60%
Ea: 0.7
B: 0
Tu: 25
°C
Vu: 5.5
Volts
相关PDF资料 |
PDF描述 |
|---|---|
| DS1971-F3+ | IBUTTON EEPROM 256KBIT F3 |
| DS1972-F3+ | IBUTTON EEPROM 1KBit F3 |
| DS1973-F3+ | IBUTTON EEPROM 4KBit F3 |
| DS1977-F5# | IBUTTON EEPROM 32KBit F5 |
| DS1982-F5+ | IBUTTON 1KBit ADD-ONLY F5 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1963S-F5+ | 功能描述:iButton SHA iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated |
| DS1965S-1-F3 | 功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated |
| DS1965S-1-F5 | 功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated |
| DS1965S-4-F3 | 功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated |
| DS1965S-4-F5 | 功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated |
发布紧急采购，3分钟左右您将得到回复。