参数资料
型号: DS21Q554
英文描述: Quad T1/E1 Transceiver 5V
中文描述: 四路T1/E1收发器(3.3V, 5.0V)
文件页数: 1/13页
文件大小: 163K
代理商: DS21Q554
DALLAS SEMICONDUCTOR
Quad T1/E1 Transceiver (5V)
Quad T1/E1 Transceiver (3.3V)
Preliminary
DS21Q552/DS21Q554
DS21Q352/DS21Q354
December 29, 1998
FEATURES
P
Four (4) Completely Independent T1 or E1 Transceivers
In One Small 27mm x 27mm Package
Each Transceiver Contains a Short & Long Haul Line Interface
Plus a Full Featured Framer with Alarm Detection/Generation,
Elastic Stores, Hardware Based Signaling Support, Per DS0
Channel Control and HDLC Controller
Each Multi-Chip Module (MCM) Contains Four Die of:
DS21352 (DS21Q352)
DS21552 (DS21Q552)
DS21354 (DS21Q354)
DS21554 (DS21Q554)
T1
T1
E1
E1
Selection Guide:
Supply
3.3V
5V
3.3V
5V
Device
DS21Q352
DS21Q552
DS21Q354
DS21Q554
See the Specific DS21352/DS21552 and DS21354/DS21554
Data Sheets for Details on their Feature Set and Operation
All Four T1 or E1 Transceivers Can be Concatenated into a Single
8.192MHz Backplane Data Stream
IEEE 1149.1 JTAG-Boundary Scan Architecture
DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible
to Allow the Same Footprint to Support T1 and E1 Applications
256–lead MCM BGA package (27mm X 27mm)
Low Power 5V CMOS or Low Power 3.3V CMOS with 5V
Tolerant Input & Outputs
DESCRIPTION
The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the
DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.
Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical
connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and
DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package
size, some signals have been deleted. These differences are detailed in Table 1.
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the
DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the
operating characteristics of the device.
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相关代理商/技术参数
参数描述
DS21Q554B 功能描述:网络控制器与处理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21Q554B+ 功能描述:网络控制器与处理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21Q554BN 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21Q554BN+ 功能描述:网络控制器与处理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21Q554BW 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray