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参数资料
| 型号： | DS21Q554 |
| 厂商： | DALLAS SEMICONDUCTOR |
| 元件分类： | Digital Transmission Interface |
| 英文描述： | DATACOM, PCM TRANSCEIVER, PBGA256 |
| 封装： | MCM, BGA-256 |
| 文件页数： | 2/7页 |
| 文件大小： | 174K |
| 代理商： | DS21Q554 |
MAX1595
Regulated 3.3V/5.0V Step-Up/
Step-Down Charge Pump
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 2V for MAX1595_ _ _33, VIN = 3V for MAX1595_ _ _50, CIN = 1F, CX = 0.22F, COUT = 1F, TA = -40° to +85°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, OUT, AOUT to GND............................................-0.3V to +6V
SHDN to PGND ........................................................-0.3V to +6V
PGND to GND .......................................................-0.3V to +0.3V
CXN to PGND.....................-0.3V to (Lower of IN + 0.8V or 6.3V)
CXP to GND ................................-0.8V to (Higher of OUT + 0.8V
or IN + 0.8V but not greater than 6V)
Continuous Output Current ...............................................150mA
Continuous Power Dissipation (TA = +70°C)
MAX (derate 4.8mW/°C above +70°C) ..................387.8mW
TQFN-EP (derate 24.4mW/°C above +70°C) .........1951.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Voltage Range
VIN
1.8
5.5
V
Input Undervoltage Lockout
Threshold
1.40
1.60
1.72
V
Input Undervoltage Lockout
Hysteresis
40
mV
TA = 0
°C to +85°C
4.85
5.05
5.15
0 < ILOAD < 125mA,
VIN = +3.0V
TA = -40
°C to +85°C
4.80
5.20
TA = 0
°C to +85°C
3.20
3.33
3.40
0 < ILOAD < 75mA, VIN
= +2.0V
TA = -40
°C to +85°C
3.16
3.44
TA = 0
°C to +85°C
3.20
3.33
3.40
Output Voltage
VOUT
0 < ILOAD < 30mA, VIN
= +1.8V
TA = -40
°C to +85°C
3.16
3.44
V
VIN = +2.0V, MAX1595_ _ _33
220
320
No-Load Input Current
IQ
VIN = +3.0V, MAX1595_ _ _50
240
350
A
Switching Frequency
fOSC
ILOAD > 20mA, VOUT > VIN
0.85
1.0
1.15
MHz
Shutdown Supply Current
ISHDN
VSHDN = 0V, VIN = +5.5V, VOUT = 0V
5
A
SHDN Input Voltage Low
VINL
VIN = 2.0V to 5.5V
0.6
V
SHDN Input Voltage High
VINH
VIN = 2.0V to 5.5V
1.6
V
SHDN Input Leakage Current
0.1
A
Note 2: Specifications to -40
°C are guaranteed by design, not production tested.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
θJA)..........41°C/W
Junction-to-Case Thermal Resistance (
θJC).................6°C/W
MAX
Junction-to-Ambient Thermal Resistance (
θJA).....206.3°C/W
Junction-to-Case Thermal Resistance (
θJC)...............42°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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