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| 型号： | DS32KHZ/WBGA |
| 厂商： | Maxim Integrated |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | IC OSC TCXO 32.768KHZ 5V 36-BGA |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 110 |
| 系列： | DS |
| 类型： | TCXO |
| 频率： | 32.768kHz |
| 输出： | CMOS |
| 电源电压： | 5V |
| 频率稳定性： | ±7.5ppm |
| 工作温度： | 0°C ~ 70°C |
| 电流 - 电源（最大）： | 220µA |
| 安装类型： | 表面贴装 |
| 尺寸/尺寸： | 0.450" L x 0.400" W（11.43mm x 10.16mm） |
| 高度： | 0.101"（2.56mm） |
| 封装/外壳： | 36-BGA |
| 包装： | 托盘 |
DS32kHz
RELATED APPLICATION NOTES
(Go to www.maxim-ic.com/RTCapps to find these application notes and more.)
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks
Application Note 701: Using the DS32kHz with Dallas RTCs
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent
damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow
temperature ( ≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow
profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that
the internal crystal is not exposed to temperatures above +150°C.
Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
THERMAL INFORMATION
PACKAGE TYPE
16-pin SO (300 mils)
36-pin BGA
THETA-J A
(°C/W)
73
43.9
THETA-J C
(°C/W)
23
18.4
PACKAGE INFORMATION
(For the latest package information, go to www.maxim-ic.com/DallasPackInfo .)
PACKAGE TYPE
14-pin Encapsulated DIP
16-pin SO (300 mils)
36-pin BGA
DOCUMENT NO.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
8
? 20 07 Maxim Integrated
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.
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