参数资料
型号: DS32KHZSN#T&R
厂商: Maxim Integrated
文件页数: 7/8页
文件大小: 0K
描述: IC OSC 32.768KHZ TEMPCOMP 16SOIC
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1,000
系列: DS
类型: TCXO
频率: 32.768kHz
输出: CMOS
电源电压: 5V
频率稳定性: ±7.5ppm
工作温度: -40°C ~ 85°C
电流 - 电源(最大): 220µA
安装类型: 表面贴装
尺寸/尺寸: 0.412" L x 0.300" W(10.46mm x 7.62mm)
高度: 0.105"(2.67mm)
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
包装: 带卷 (TR)
DS32kHz
Figure 4. Power-Supply Connections
4.5V - 5.5V
4.5V - 5.5V
Vcc
Vcc
Vcc
2.7V - 3.3V
Vbat
32.768kHz out
2.7V - 5.5V
Vbat
32.768kHz out
Vbat
32.768kHz out
GND
A
GND
B
GND
C
Figure 5 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the
interchangeable option. Using this connection scheme and the recommended layout provides a solution, which
requires no hardware modifications. Only one device should be used at a time, and both layouts should be located
very close together if the recommended layout is not used.
The DS32kHz I CC and I BAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz
crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the I CC and
I BAT currents significantly and increase the current consumption of the RTC as well. Figure 6 shows one circuit that
can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary
depending on the RTC used. However, values of 1.0M Ω and 100pF are recommended as a starting point. R2 is
used to shift the input waveform to the proper level. The recommended value for R2 is 33k Ω .
Figure 5. DS32kHz Connections
V CC
32kHz out
X1 or Xin
V CC
V BAT
DS32kHz
32.768 Hz
RTC
X2 or Xout
V BAT
A PC board can be laid out so that the RTC can use either the DS32kHz or a crystal
Figure 6. DS32kHz and RTC Connections
V CC
R1
1M Ω
C1
100pF
V CC
V BAT
DS32kHz
R2
33k Ω
X1
X2
RTC
V BAT
7 of 8
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