参数资料
型号: DS33M33N+
厂商: Maxim Integrated Products
文件页数: 10/21页
文件大小: 0K
描述: IC MAPPER ETHERNET 256CSBGA
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 90
应用: 数据传输
接口: SPI
电源电压: 1.8V,2.5V,3.3V
封装/外壳: 256-BGA,CSBGA
供应商设备封装: 256-CSBGA(17x17)
包装: 托盘
安装类型: 表面贴装
DS33M30/M31/M33 DATA SHEET
Rev: 010809
18 of 21
2. Standards Compliance
The DS33M30 family of products adhere to the applicable telecommunications standards. Table 2-1 provides the
specifications and relevant sections.
Table 2-1. Standards Compliance Summary
SPECIFICATION
SPECIFICATION TITLE
ANSI
T1.102-1993
Digital Hierarchy – Electrical Interfaces
T1.105-2001
Synchronous Optical Network (SONET) -- Basic Description including Multiplex Structure,
Rates, and Formats
T1.105.02-2001
Synchronous Optical Network (SONET) – Payload Mappings
T1.105.03-1994
Synchronous Optical Network (SONET) – Jitter at Network Interfaces
T1.105.03b-1997
Synchronous Optical Network (SONET) – Jitter at Network Interfaces – DS3 Wander
Supplement
T1.105.06-2001
Synchronous Optical Network (SONET) – Physical Layer Specifications
T1.107-1995
Digital Hierarchy – Formats Specification
T1.107a-1990
Digital Hierarchy – Supplement to Formats Specifications (DS3 Format Applications)
T1.231-1997
Digital Hierarchy – Layer 1 In-Service Digital Transmission Performance Monitoring
T1.231.03-2003
DS3 – Layer 1 In-Service Digital Transmission Performance Monitoring
T1.231.04-2003
SONET – Layer 1 In-Service Digital Transmission Performance Monitoring
T1.404-1994
Network-to-Customer Installation – DS3 Metallic Interface Specification
T1.646-1995
Broadband ISDN – Physical Layer Specification for User-Network Interfaces Including
DS1/ATM
ETSI
ETS 300 337
Transmission and Multiplexing (TM); Generic frame structures for the transport of various
signals (including Asynchronous Transfer Mode (ATM) cells and Synchronous Digital
Hierarchy (SDH) elements) at the ITU-T Recommendation G.702 hierarchical rates of 2 048
Kbit/s, 34 368 Kbit/s and 139 264 Kbit/s, Second Edition, June, 1997
ETS 300 417-1-1
Generic Functional Requirements for Synchronous Digital Hierarchy (SDH) equipment,
January 1996
ETS 300 686
Business TeleCommunications; 34Mbit/s and 140Mbits/s digital leased lines (D34U, D34S,
D140U and D140S); Network interface presentation, 1996
ETS 300 687
Business TeleCommunications; 34Mbit/s digital leased lines (D34U and D34S); Connection
characteristics, 1996
ETS 300 689
Business TeleCommunications (BTC); 34 Mbit/s digital leased lines (D34U and D34S),
Terminal equipment interface, V 1.2.1, 2001-07
TBR 24
Business TeleCommunications; 34Mbit/s digital unstructured and structured lease lines;
attachment requirements for terminal equipment interface, 1997
IETF
RFC 1662
PPP in HDLC-like Framing, July, 1994
RFC 2615
PPP over SONET/SDH; June 1999
RFC 2496
Definition of Managed Objects for the DS3/E3 Interface Type, January, 1999
RFC 2819
Remote Network Monitoring Management Information Base; May 2000
ISO
ISO 3309:1993
Information Technology – Telecommunications & information exchange between systems –
High Level Data Link Control (HDLC) procedures – Frame structure, Fifth Edition, 1993
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DS33M33N+ 功能描述:网络控制器与处理器 IC Ethernet Over SONET/SDH Mapper RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS33M33N+W 功能描述:网络控制器与处理器 IC Ethernet Over SONET/SDH Mapper RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS33R11 功能描述:网络控制器与处理器 IC E-net Mapper w/Int T1/E1/J1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS33R11+ 功能描述:网络控制器与处理器 IC E-net Mapper w/Int T1/E1/J1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS33R11+CJ2 功能描述:网络控制器与处理器 IC E-net Mapper w/Int T1/E1/J1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流(最大值):595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray