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参数资料
| 型号： | DS8023-RJX+T&R |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/17页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE SMART CARD 28-TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 智能卡 |
| 接口： | 模拟 |
| 电源电压： | 2.7 V ~ 6 V |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
| 配用： | DS8023-KIT-ND - EVALUATION KIT FOR DS8023 |
DS8023
Smart Card Interface
16
Maxim Integrated
Applications Information
Performance can be affected by the layout of the appli-
cation. For example, an additional cross-capacitance of
1pF between card reader contacts C2 (RST) and C3
(CLK) or C2 (RST) and C7 (I/O) can cause contact C2
to be polluted with high-frequency noise from C3 (or
C7). In this case, include a 100pF capacitor between
contacts C2 and CGND.
Application recommendations include the following:
Ensure there is ample ground area around the
DS8023 and the connector; place the DS8023
very near to the connector; decouple the VDD and
VDDA lines separately. These lines are best posi-
tioned under the connector.
The DS8023 and the host microcontroller must use
the same VDD supply. Pins CLKDIV1, CLKDIV2,
RSTIN, PRES, AUX1IN, I/OIN, AUX2IN, 5V/3V,
CMDVCC, and OFF are referenced to VDD; if pin
XTAL1 is to be driven by an external clock, also
reference this pin to VDD.
Trace C3 (CLK) should be placed as far as possi-
ble from the other traces.
The trace connecting CGND to C5 (GND) should
be straight (the two capacitors on C1 (VCC) should
be connected to this ground trace).
Avoid ground loops among CGND, PGND, and
GND.
Decouple VDDA and VDD separately; if the two
supplies are the same in the application, they
should be connected in a star on the main trace.
Connect a 100nF capacitor (ESR < 100m
Ω)
between VCC and CGND and place near the
DS8023’s VCC pin.
Connect a 100nF or 220nF capacitor (220nF pre-
ferred, ESR < 100m
Ω) between VCC and CGND
and place near the smart card socket’s C1 contact.
With all these layout precautions, noise should be kept
to an acceptable level and jitter on C3 (CLK) should be
less than 100ps.
Technical Support
Selector Guide
Note: Contact the factory for availability of other variants and
package options.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
PART
CURRENT
VOLTAGES
SUPPORTED (V)
SUPPORTS
STOP
MODE?
PIN-
PACKAGE
DS8023-RJX+
1.8, 3.0, 5.0
Yes
28 TSSOP
DS8023-RRX+
1.8, 3.0, 5.0
Yes
28 SO
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE NO.
LAND
PATTERN NO.
28 SO (300 mils)
W28+6
28 TSSOP
U28+1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DS8023-RRX+ | 功能描述:接口 - 专用 Smart Card Interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| DS8023-RRX+T&R | 制造商:Maxim Integrated Products 功能描述:DS8023 SMART CARD INT 28 SOIC T&R - Tape and Reel 制造商:Maxim Integrated Products 功能描述:IC INTERFACE SMART CARD 28-SOIC |
| DS8023-RRX+T&R | 功能描述:接口 - 专用 Smart Card Interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| DS8024 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:智能卡接口 |
| DS8024_V3 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Smart Card Interface |
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