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参数资料
| 型号： | DS8113-JNG+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/17页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE SMART CARD 28-TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 241 |
| 应用： | 智能卡 |
| 接口： | 模拟 |
| 电源电压： | 2.7 V ~ 6 V |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 管件 |
| 安装类型： | 表面贴装 |
DS8113
Smart Card Interface
16
______________________________________________________________________________________
Applications Information
Performance can be affected by the layout of the appli-
cation. For example, an additional cross-capacitance of
1pF between card reader contacts C2 (RST) and C3
(CLK) or C2 (RST) and C7 (I/O) can cause contact C2
to be polluted with high-frequency noise from C3 (or
C7). In this case, include a 100pF capacitor between
contacts C2 and CGND.
Application recommendations include the following:
Ensure there is ample ground area around the
DS8113 and the connector; place the DS8113
very near to the connector; decouple the VDD and
VDDA lines separately. These lines are best posi-
tioned under the connector, connected in a star on
the main trace.
The DS8113 and the host microcontroller must use
the same VDD supply. Pins CLKDIV1, CLKDIV2,
RSTIN, PRES, AUX1IN, I/OIN, AUX2IN, 5V/3V,
1_8V, CMDVCC, and OFF are referenced to VDD;
if pin XTAL1 is to be driven by an external clock,
also reference this pin to VDD.
Trace C3 (CLK) should be placed as far as possi-
ble from the other traces.
The trace connecting CGND to C5 (GND) should
be straight (the two capacitors on C1 (VCC)
should be connected to this ground trace).
Avoid ground loops among CGND, PGND, and
GND.
With all these layout precautions, noise should be kept
to an acceptable level and jitter on C3 (CLK) should be
less than 100ps. Reference layouts, designs, and an
evaluation kit are available on request.
Selector Guide
Note: Contact the factory for availability of other variants and
package options.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
PART
LOW STOP-
MODE POWER
LOW ACTIVE-
MODE POWER
PIN-
PACKAGE
DS8113-RNG+
Yes
28 SO
DS8113-JNG+
Yes
28 TSSOP
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
28 SO (300 mils)
W28+6
28 TSSOP
U28+2
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DS8113-JNG+ | 功能描述:接口 - 专用 Smart Card Interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| DS8113-JNG+T&R | 制造商:Maxim Integrated Products 功能描述:DS8113 SMARTCARD INT 28 TSSOP T&R - Tape and Reel 制造商:Maxim Integrated Products 功能描述:IC INTERFACE SMART CARD 28-TSSOP |
| DS8113-JNG+T&R | 功能描述:接口 - 专用 Smart Card Interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| DS8113-KIT | 制造商:Maxim Integrated Products 功能描述:EMV EVALUATION KIT FOR THE DS8113 - Boxed Product (Development Kits) |
| DS8113-RNG+ | 功能描述:接口 - 专用 Smart Card Interface RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
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