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参数资料
型号： DSPIC30F2010-20E/SP
厂商： Microchip Technology
文件页数： 46/49页
文件大小： 0K
描述： IC DSPIC MCU/DSP 12K 28DIP
产品培训模块： Asynchronous Stimulus
标准包装： 15
系列： dsPIC™ 30F
核心处理器： dsPIC
芯体尺寸： 16-位
速度： 20 MIPS
连通性： I²C，SPI，UART/USART
外围设备： 高级欠压探测/复位，电机控制 PWM，QEI，POR，PWM，WDT
输入/输出数： 20
程序存储器容量： 12KB（4K x 24）
程序存储器类型： 闪存
EEPROM 大小： 1K x 8
RAM 容量： 512 x 8
电压 - 电源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
数据转换器： A/D 6x10b
振荡器型： 内部
工作温度： -40°C ~ 125°C
封装/外壳： 28-DIP（0.300"，7.62mm）
包装： 管件
dsPIC30F2010
DS70118J-page 6
2011 Microchip Technology Inc.
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 7
2.0
CPU Architecture Overview........................................................................................................................................................ 11
3.0
Memory Organization ................................................................................................................................................................. 19
4.0
Address Generator Units ............................................................................................................................................................ 31
5.0
Interrupts .................................................................................................................................................................................... 37
6.0
Flash Program Memory .............................................................................................................................................................. 43
7.0
Data EEPROM Memory ............................................................................................................................................................. 49
8.0
I/O Ports ..................................................................................................................................................................................... 53
9.0
Timer1 Module ........................................................................................................................................................................... 57
10.0 Timer2/3 Module ........................................................................................................................................................................ 61
11.0 Input Capture Module ................................................................................................................................................................. 67
12.0 Output Compare Module ............................................................................................................................................................ 71
13.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 75
14.0 Motor Control PWM Module ....................................................................................................................................................... 81
15.0 SPI Module ................................................................................................................................................................................. 91
16.0 I2C Module ............................................................................................................................................................................. 95
17.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103
18.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 111
19.0 System Integration ................................................................................................................................................................... 121
20.0 Instruction Set Summary .......................................................................................................................................................... 135
21.0 Development Support............................................................................................................................................................... 143
22.0 Electrical Characteristics .......................................................................................................................................................... 147
23.0 Packaging Information.............................................................................................................................................................. 185
The Microchip Web Site ..................................................................................................................................................................... 199
Customer Change Notification Service .............................................................................................................................................. 199
Customer Support .............................................................................................................................................................................. 199
Reader Response .............................................................................................................................................................................. 200
Product Identification System............................................................................................................................................................. 201
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dsPIC30F2010-20I/MM 功能描述:数字信号处理器和控制器 - DSP, DSC 16B MCU DSP 28LD 20MIPS 12KB FLASH RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-20I/MMG 功能描述:数字信号处理器和控制器 - DSP, DSC 16 Bit MCU/DSP 28LD 20M 12KB FL RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-20I/SO 功能描述:数字信号处理器和控制器 - DSP, DSC 20MHz 12KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-20I/SOG 功能描述:数字信号处理器和控制器 - DSP, DSC 16bit Signal Cntrlr RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-20I/SP 功能描述:数字信号处理器和控制器 - DSP, DSC 20MHz 12KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
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