参数资料
型号: DV75C-020.0M
厂商: Connor-Winfield
文件页数: 3/3页
文件大小: 0K
描述: OSC TCXO 20.000 MHZ 3.3V SMD
标准包装: 1
系列: DV75C
类型: TCXO
频率: 20MHz
功能: 三态(输出启用)
输出: LVCMOS
电源电压: 3.135 V ~ 3.465 V
频率稳定性: ±0.28ppm
工作温度: -40°C ~ 85°C
电流 - 电源(最大): 6mA
其它名称: CW748DKR
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Package Layout
0.276 ± 0.006
0.079 Max.
Suggested Pad Layout
Pad Connections
(7.0mm)
(2.0mm)
0.071
(Top View)
4
3
(1.8mm)
4 Places
Pad 1
0.03 4
(0. 90 mm)
DV75C 1202
12.8 MHZ
1 2
(Bottom View)
0.197
± 0.006
(5.0mm)
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
0.165
(4.2mm)
1
(Top View)
0.224
(5.7mm)
2
0.047
(1.2mm)
4 Places
Keep
Out *
Area
1:
2:
3:
4:
N/C
Ground
Output (Fo)
Supply Voltage (Vcc)
(4 Places)
4
3
* Do not route any traces in the keep out area. It is
0.0 55
( 1.40 mm)
recommended the next layer under the keep out area
(4 Places)
is to be ground plane.
Design Recommendations
Output Waveform
Vcc, should have
a large copper
0.010”(0.254mm)
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
Recommended
clearance
inductance
for internal
Vcc
50 Ohm trace
<1”by design
<0.1”(2.54mm)
from the pad.
4
9
10
3
5
4
copper flood.
Ground
Buffer
1
Top View
2
Ground,
should have
a large copper
Top View
Ground
1V/Div
area for reduced
inductance.
50 Ohm Trace
Test Circuit
OSC
Without
Output
TOP LAYER
GROUND LAYER
Vias
Buffer
Vcc
Supply
Voltage
BOTTOM LAYER
0.1 uF
Bypass
10 nF
Bypass
4
3
15 pF
Output
Attention: To achieve optimal frequency stability, and in some cases to meet the specification stated on this data
sheet, it is required that the circuit connected to this TCXO output must have the equivalent input capacitance
that is specified by the nominal load capacitance. Deviations from the nominal load capacitance will have a
graduated effect on the stability of approximately 20 ppb per pF load difference.
N/C
1
2
Tape and Reel Dimensions
PIN 1
Solder Profile
8.46 DIA
(216mm DIA)
.69
(17.5mm)
.08
(2.0mm)
.08
(2.0mm)
.31
(7.9mm)
Temperature
260°C
220°C
180°C
260°C
1.00 DIA
(25mm DIA)
.08
(2.0mm)
9.84 DIA
(250mm DIA)
3.15
(80mm)
.21
(5.4mm)
.315
(8.0mm)
.157
(4.0mm)
.06 DIA
(1.5mm DIA)
Direction
Of
Feed
(Customer)
150°C
120°C
0
Up to 120 s
Typical
10 s
60 to 90 s
Typical
Meets IPC/JEDEC J-STD-020C
.295 (7.5mm)
MEETS EIA-481A and EIAJ-1009B
2,000 PCS/REEL
.07 (1.75mm)
.83 (16.0mm)
Revision 00
Revision 01
Revision 02
Revision 03
Revision History
Data sheet released 01/11/12
Removed tri-state information from features and description. 11/26/12.
Added "Applications", Phase noise, TIE, MTIE and TDEV plots. 04/15/13.
Removed TR information from Ordering Information. 12/03/13
Bulletin
Page
Revision
Date
Tx355
3 of 3
03
03 Dec 2013
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. All dimensions in inches.
? Copyright 2014 The Connor-Winfield Corporation
Not intended for life support applications.
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