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| 型号： | DV75D-020.0M |
| 厂商： | Connor-Winfield |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | OSC TCXO 20.000 MHZ 3.3V SMD |
| 标准包装： | 1 |
| 系列： | DV75D |
| 类型： | TCXO |
| 频率： | 20MHz |
| 功能： | 三态（输出启用） |
| 输出： | LVCMOS |
| 电源电压： | 3.135 V ~ 3.465 V |
| 频率稳定性： | ±1ppm |
| 工作温度： | -40°C ~ 85°C |
| 电流 - 电源（最大）： | 6mA |
| 其它名称： | CW754DKR |
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
Package Layout
Suggested Pad Layout
Pad Connections
0.276 ± 0.006
(7.0mm)
(Top View)
0.079 Max.
(2.0mm)
0.071
(1.8mm)
4 Places
1:
2:
3:
4:
N/C
Ground
Output (Fo)
Supply Voltage (Vcc)
0.197
4
3
DV75C 1202
12.8 MHZ
± 0.006
(5.0mm)
Pad 1
0.165
(4.2mm)
(Top View)
0.047
(1.2mm)
4 Places
Output Waveform
0.03 4
(0. 90 mm)
1 2
(Bottom View)
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
1
0.224
(5.7mm)
2
Keep
Out *
Area
(4 Places)
4
3
* Do not route any traces in the keep out area. It is
0.0 55
( 1.40 mm)
recommended the next layer under the keep out area
(4 Places)
is to be ground plane.
Design Recommendations
1V/Div
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
4
9
3
5
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
Vcc
50 Ohm trace
<1”by design
Buffer
Test Circuit
10
4
Ground
Vcc
1
Top View
2
Ground,
should have
a large copper
Top View
Ground
Supply
Voltage
area for reduced
inductance.
0.1 uF
10 nF
4
3
Output
Output
Buffer
OSC
50 Ohm Trace
Without
Vias
Bypass
Bypass
1
2
15 pF
TOP LAYER
GROUND LAYER
BOTTOM LAYER
N/C
Attention: To achieve optimal frequency stability, and in some cases to meet the specification stated on this data
sheet, it is required that the circuit connected to this TCXO output must have the equivalent input capacitance
that is specified by the nominal load capacitance. Deviations from the nominal load capacitance will have a
graduated effect on the stability of approximately 20 ppb per pF load difference.
Tape and Reel Dimensions
PIN 1
Temperature
260°C
220°C
180°C
150°C
120°C
Solder Profile
260°C
8.46 DIA
(216mm DIA)
.69
(17.5mm)
.08
(2.0mm)
.08
(2.0mm)
.31
(7.9mm)
.21
(5.4mm)
0
60 to 90 s
Typical
.08
(2.0mm)
9.84 DIA
(250mm DIA)
3.15
(80mm)
.315
(8.0mm)
.157
(4.0mm)
.06 DIA
(1.5mm DIA)
Direction
Of
Feed
(Customer)
10 s
Up to 120 s
Typical
Meets IPC/JEDEC J-STD-020C
1.00 DIA
(25mm DIA)
.295 (7.5mm)
MEETS EIA-481A and EIAJ-1009B
2,000 PCS/REEL
.07 (1.75mm)
.83 (16.0mm)
Revision 00
Revision 01
Revision 02
Revision 03
Revision History
Data sheet released 01/11/12
Removed tri-state information from features and description. 11/26/12.
Added "Applications" 04/15/13
Removed TR from Ordering Information. 12/03/13
Bulletin
Page
Revision
Date
Tx356
2 of 2
03
03 Dec 2013
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. Not intended for life support applications.
All dimensions in inches. ? Copyright 2013 The Connor-Winfield Corporation
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