参数资料
型号: DVA16XP187
厂商: Microchip Technology
文件页数: 11/18页
文件大小: 0K
描述: ADAPTER FOR PIC16F716 18DIP
标准包装: 1
转换源(适配器端): *
转换到(适配器端): *
适用于相关产品: ICE2000
Processor Module and Device Adapter Specification
6.2
TQFP/PLCC Device Footprints
FIGURE 6-3:
DVA DRAWING –
TQFP/PLCC device adapter footprints shown will
accept board stackers like Samtec series DWM 0.050
Pitch Stackers. These stackers can be soldered in
place during development/emulation and eliminate the
DOUBLE-ROW TQFP/PLCC
B
need for any other sockets.
w’
x
FIGURE 6-2:
DVA DRAWING –
SINGLE-ROW TQFP/PLCC
B
A
w
z’
z
y’
x’
y
w’
x
A
w
z’
z
y’
x’
y
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
0.028 DIA
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
PLATED-THRU
HOLES
0.960 1.160
0.050
0.028 DIA
PLATED-THRU
HOLES
0.050
C
C
0.960
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Device
44-Pin (TQFP)
64/68-Pin (TQFP/PLCC)
80/84-Pin (TQFP/PLCC)
C
0.800
0.960
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of device is 80/84-pin TQFP/PLCC.
? 2006 Microchip Technology Inc.
DS51140M-page 11
相关PDF资料
PDF描述
GMM10DTBS CONN EDGECARD 20POS R/A .156 SLD
RP10-4815SE/M1-HC CONV DC/DC 10W 36-75VIN 15VOUT
GSM10DTAS CONN EDGECARD 20POS R/A .156 SLD
400PK33MEFC12.5X25 CAP ALUM 33UF 400V 20% RADIAL
GMM10DTAS CONN EDGECARD 20POS R/A .156 SLD
相关代理商/技术参数
参数描述
DVA16XP200 功能描述:插座和适配器 PIC16C717 770 771 Device Adapter RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x
DVA16XP201 功能描述:插座和适配器 PIC16C432 Dev Adap RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x
DVA16XP202 功能描述:插座和适配器 PIC16C781/782 Device Adapter RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x
DVA16XP280 功能描述:插座和适配器 PIC16C55 55A 57 57C Dev Adap RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x
DVA16XP281 制造商:Microchip Technology Inc 功能描述:DEVICE ADAPTOR