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参数资料
| 型号： | E2K110B7473MB-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | CAP ARRAY 2CH 0.047UF 16V 0504 |
| 产品变化通告： | X5R, X7R Part Number Change |
| 标准包装： | 4,000 |
| 电容： | 0.047µF |
| 电压 - 额定： | 16V |
| 电介质材料： | 陶瓷 |
| 电容器数量： | 2 |
| 电路类型： | 隔离 |
| 温度系数： | X7R |
| 容差： | ±20% |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0504（1210 公制） |
| 尺寸/尺寸： | 0.054" L x 0.039" W（1.37mm x 1.00mm） |
| 高度 - 座高（最大）： | 0.024"（0.60mm） |
| 包装： | 带卷 (TR) |
| 其它名称： | CE E2K110 B7473MB-T E2K110BJ473MB-T E2K110BJ473MB-T-ND |
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
◆ Pattern con?gurations （ Capacitor layout on PCBs ）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
?ection.
Items
De?ection of board
Not recommended
Recommended
Technical
consider-
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
ations
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
◆ Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions ◆ Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
◆ Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
（ 1 ） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board de?ection.
（ 2 ） The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（ 3 ） To reduce the amount of de?ection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
Technical
consider-
ations
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
◆ Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
（ 1 ） Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have suf?cient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（ 2 ） The recommended amount of adhesives is as follows;
［ Recommended condition ］
Figure 212/316 case sizes as examples
a
b
0.3mm min
100 to 120 μ m
c Adhesives shall not contact land
＊ This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
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mlcc_prec-P2
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| E2K110BJ104KB-T | 制造商:Taiyo Yuden 功能描述:Array Type Ceramic Capacitor |
| E2K110BJ105KA-T | 功能描述:电容器阵列与网络 CAP ARRAY 0504 16V X5R 1uF 10% RoHS:否 制造商:AVX 电容:0.1 uF 容差:20 % 电压额定值:6.3 V 元件数量:2 工作温度范围: 外壳长度:0.8 mm 外壳宽度:1.6 mm 外壳高度:0.5 mm 端接类型:SMD/SMT 系列:PG |
| E2K110BJ105MA-T | 功能描述:电容器阵列与网络 CAP ARRAY 0504 16V X5R 1uF 20% RoHS:否 制造商:AVX 电容:0.1 uF 容差:20 % 电压额定值:6.3 V 元件数量:2 工作温度范围: 外壳长度:0.8 mm 外壳宽度:1.6 mm 外壳高度:0.5 mm 端接类型:SMD/SMT 系列:PG |
| E2K110BJ473KB-T | 制造商:Taiyo Yuden 功能描述:Array Type Ceramic Capacitor |
| E2K212BJ105KD-T | 功能描述:电容器阵列与网络 CAP ARRAY 0805 16V X5R 1uF 10% RoHS:否 制造商:AVX 电容:0.1 uF 容差:20 % 电压额定值:6.3 V 元件数量:2 工作温度范围: 外壳长度:0.8 mm 外壳宽度:1.6 mm 外壳高度:0.5 mm 端接类型:SMD/SMT 系列:PG |
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