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参数资料
| 型号： | E819-EDGE819 |
| 英文描述： | Octal 18 V Pin Electronics Driver |
| 中文描述： | 八路18 V引脚电子驱动器 |
| 文件页数： | 9/11页 |
| 文件大小： | 84K |
| 代理商： | E819-EDGE819 |
7
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS – ATE
Edge819
PRELIMINARY
Package Information (continued)
–A, B, D–
3
e / 2
DETAIL "A"
–
0.40 MIN.
0 – 7
0.13 / 0.30 R. TYP.
GAGE
PLANE
BASE
PLANE
SEATING
PLANE
0.25
1.60 REF.
L
C
A2
0.10 S
0.13
R. MIN.
DETAIL "B"
0 MIN.
A1
–H–
0.076
–C–
2
8
12
B
12 – 16
12 – 16
D
C
S
M
S
ccc
A – B
A
SEE DETAIL "B"
B
1
BASE METAL
0.13 / 0.17
0.13 / 0.23
1.28 REF.
WITH LEAD FINISH
SECTION C–C
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting
line.
3. Datums A-B and -D- to be determined where centerline between
leads exits plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254 mm per side. Dimensions
D1 and E1 do include mold mismatch and are determined at
datum plane -H-.
6. “N” is the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
8. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition.
Dambar cannot
be located on the lowerradius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this
package family is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MS-108
and MS-022.
12. These dimensions apply to the flat section of the lead between
0.10 mm and 0.25 mm from the lead tip.
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08
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.
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.
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Variations
(all dimensions in millimeters)
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