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参数资料
| 型号： | EB81-S0C1560W |
| 厂商： | Vishay Dale |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | CONN EDGEBOARD DUAL 30POS 5A |
| 标准包装： | 18 |
| 系列： | EB8 |
| 卡类型： | 非指定 - 双边 |
| 类型： | 母头 |
| Number of Positions/Bay/Row： | 15 |
| 位置数： | 30 |
| 卡厚度： | 0.054" ~ 0.071"（1.37mm ~ 1.80mm） |
| 行数： | 2 |
| 间距： | 0.156"（3.96mm） |
| 安装类型： | 通孔 |
| 端子： | 焊接 |
| 触点材料： | 磷青铜 |
| 触点表面涂层： | 金 |
| 触点类型：： | 环形波纹管 |
| 颜色： | 绿 |
| 包装： | 散装 |
| 材料 - 绝缘体： | 苯二甲酸二烯丙酯（DAP） |
| 工作温度： | -55°C ~ 125°C |
| 读数： | 双 |
| 其它名称： | EB81-C15SGW T02 |
EB8
Vishay Dale
Edgeboard Connectors, Dual Readout
FEATURES
? 0.156" C-C x 0.200" grid (3.96 mm x 5.08 mm)
? Greater design latitude
3 body materials: Diallyl phthalate, phenolic and
glass-filled polyester
6 contact termination styles, 8 body sizes, 7 mounting
styles
? Bifurcated bellows contacts provide 2 flexing contact
surfaces to assure positive contact
ELECTRICAL SPECIFICATIONS
Current Rating: 5 A
Test Voltage Between Contacts:
At sea level: 1800 V RMS
At 70 000 feet (21 336 meters): 450 V RMS
Insulation Resistance: 5000 M Ω minimum at 500 V DC
potential
Contact Resistance: 30 mV maximum at rated current (with
gold plating)
Operating Temperature: - 55 °C to + 125 °C
Humidity: 96 h at 90 % relative humidity at + 40 °C, dried at
room temperature for 3 h minimum, insulation resistance
was greater than 5000 M Ω
Durability: (With gold plating) After 500 cycles of insertion
and withdrawal of a 0.070" (1.78 mm) thick steel test
gauge, contact resistance less than 0.030 V at 5 A and
individual contact retention force when measured with 0.054"
(1.37 mm) thick steel test slug greater than ? oz.
Shock: Three 50G shocks in each of 3 mutually
perpendicular planes with no loss of continuity
Vibration: 2 h in each of 3 mutually perpendicular planes,
frequency sweep 10 cps to 55 cps at 0.06 double amplitude
with no loss of continuity
PHYSICAL SPECIFICATIONS
Contact Type: Bifurcated bellows
Number of Contacts: 6, 10, 12, 15, 18, 22, 24, 25 per side
Contact Spacing: 0.156" (3.96 mm) center to center
Card Thickness: 0.054" to 0.071" (1.37 mm to 1.80 mm)
Card Slot Depth: Dual readout = 0.330" (8.38 mm)
Note
? High temperature burn-in, edgeboard connectors, 0.156"
(3.96 mm) center to center are on www.vishay.com/doc?36006
ORDERING INFORMATION
? Accepts PC board thickness of 0.054" to 0.071" (1.37 mm
to 1.80 mm)
? Polarization between contact positions in all sizes
? Selective gold plating
? Recognized under the Component Program of
Underwriters Laboratories, Inc. listed under file
E65524, project 77CH3889
APPLICATIONS
For use with 0.062" (1.57 mm) printed circuit boards requiring
an edgeboard type connector on 0.156" (3.96 mm) centers
MATERIAL SPECIFICATIONS
Body:
“1” glass-filled diallyl phtalate per MIL-M-14, type SDG-F
green, flame retardant (UL 94 V-0)
“2” glass-filled phenolic per MIL-M-14, type MFH dark green,
flame retardant (UL 94 V-0)
“3” thermoplastic polyester, glass-filled, black, flame
retardant (UL 94 V-0)
“5” thermoplastic polyphenylene sulfied, glass-filled, brown,
flame retardant (UL 94 V-0)
Contacts: Phosphor bronze
Polarizing Key: Glass reinforced nylon, flame retardant
(UL 94H-B)
Contact Plating: Gold (See Ordering Information)
EB8 1
B
A 22 SG
X
A
MODEL BODY MATERIAL
OPTIONAL
CONTACTS
STANDARD CONTACTS
PER SIDE
TERMINAL
CONTACT PLATING
MOUNTING
VARIATIONS
POLARIZING
KEY POSITIONS
Optional body
VARIATIONS
SG = Selective gold plating
material
Beryllium copper
6, 10, 12,
(0.00003" (0.000762 mm)
Key(s) are located to
1 = Diallyl
contacts optional.
A, C, D,
15, 18, 22, minimum thick) on contact area
right of position(s)
phthalate
2 = Phenolic
3 = Glass-filled
polyester
5 = Glass-filled
polyphenylene
sulfied
Available in “A”
and “E” contact
styles only (Omit
for standard)
K, L, or E
24 or 25
with gold flash on terminal
SGF = Selective gold plating
(0.000010" (0.000254 mm)
minimum thick) on contact area
with gold flash on terminal.
All gold plating over 0.00005"
(0.00127 mm) minimum nickel
underplate.
designated. Required
only when polarizing
keys are to be factory
installed
Contact factory for additional
plating options.
www.vishay.com
14
For technical questions, contact: connectors@vishay.com
Document Number: 36005
Revision: 16-Feb-09
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EB81-S0C1860X | 功能描述:标准卡缘连接器 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 产品类型:Contacts 位置/触点数量:60 安装角:Straight 电路板厚度: 安装风格:SMD/SMT 节距:8 mm 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Copper Alloy 触点电镀:Gold |
| EB81-S0D1540X | 功能描述:标准卡缘连接器 EB81-D15SGFXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 产品类型:Contacts 位置/触点数量:60 安装角:Straight 电路板厚度: 安装风格:SMD/SMT 节距:8 mm 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Copper Alloy 触点电镀:Gold |
| EB81-S0D1560X | 功能描述:标准卡缘连接器 EB81-D15SGXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 产品类型:Contacts 位置/触点数量:60 安装角:Straight 电路板厚度: 安装风格:SMD/SMT 节距:8 mm 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Copper Alloy 触点电镀:Gold |
| EB81-S0D1860X | 功能描述:标准卡缘连接器 EB81-D18SGXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 产品类型:Contacts 位置/触点数量:60 安装角:Straight 电路板厚度: 安装风格:SMD/SMT 节距:8 mm 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Copper Alloy 触点电镀:Gold |
| EB81-S0D2260X | 功能描述:标准卡缘连接器 EB81-D22SGXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 产品类型:Contacts 位置/触点数量:60 安装角:Straight 电路板厚度: 安装风格:SMD/SMT 节距:8 mm 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Copper Alloy 触点电镀:Gold |
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