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参数资料
| 型号： | ECG001B |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模块 |
| 文件页数： | 4/5页 |
| 文件大小： | 239K |
| 代理商： | ECG001B |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 5 May 2006
ECG001B
InGaP HBT Gain Block
Product Information
The Communications Edge TM
ECG001B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E001G” designator with an alphanumeric lot
code on the top surface of the package.
The
obsolete tin-lead package is marked with an
“E001”
designator
followed
by
an
alphanumeric lot code; it may also have been
marked with a “B” designator followed by a 3-
digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
相关PDF资料 |
PDF描述 |
|---|---|
| ECG001F-G | InGaP HBT Gain Block |
| ECG001F-PCB | InGaP HBT Gain Block |
| ECG001F | InGaP HBT Gain Block |
| ECG001 | |
| ECG002 | |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ECG001B-G | 功能描述:射频放大器 DC-6 GHz 22dB Gain at 1 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ECG001B-PCB | 功能描述:射频开发工具 700-2400MHz Eval Brd 22dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| ECG001F | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| ECG001F-G | 功能描述:射频放大器 DC-6 GHz 22dB Gain at 1 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| ECG001F-PCB | 功能描述:射频开发工具 700-2400MHz Eval Brd 22.4dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
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