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参数资料
| 型号： | ECG055C-G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模块 |
| 文件页数： | 4/4页 |
| 文件大小： | 150K |
| 代理商： | ECG055C-G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 4 of 4
April 2006
ECG055C
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
ECG055C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260
°C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with an “S” designator on the top surface of the
package. The obsolete tin-lead package is
marked with a two-digit numeric lot code
followed with a “Y” designator; it may also
have been marked with a “Y” designator
followed by a two-digit lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
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| ECG099 | Watt, High Linearity InGaP HBT Amplifier |
| ECG100 | TRANSISTOR | BJT | PNP | 20V V(BR)CEO | 300MA I(C) | TO-5 |
| ECG101 | TRANSISTOR | BJT | NPN | 20V V(BR)CEO | 300MA I(C) | TO-5 |
| ECG102 | TRANSISTOR | BJT | PNP | 16V V(BR)CEO | 300MA I(C) | TO-5 |
相关代理商/技术参数 |
参数描述 |
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| ECG055C-PCB | 功能描述:射频开发工具 700-2400MHz Eval Brd 20dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| ECG099 | 制造商:WJCI 制造商全称:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECG099B | 制造商:WJCI 制造商全称:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECG10 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | BJT | NPN | 12V V(BR)CEO | 70MA I(C) | TO-92 |
| ECG100 | 制造商:ECG 功能描述: |
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