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参数资料
| 型号： | ECG099 |
| 英文描述： | Watt, High Linearity InGaP HBT Amplifier |
| 中文描述： | 瓦，高线性InGaP HBT功率放大器 |
| 文件页数： | 5/7页 |
| 文件大小： | 648K |
| 代理商： | ECG099 |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 5 of 7
June 2005
AH118 / ECG099
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge TM
AH118-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
° C
Thermal Resistance (1)
92
° C / W
Junction Temperature (2)
159
° C
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 160 mA at an 85
° C ground tab temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
° C.
Product Marking
The component will be marked with an
“AH118” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235
° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
60
70
80
90
100
110
120
Tab Temperature (°C)
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PDF描述 |
|---|---|
| ECG100 | TRANSISTOR | BJT | PNP | 20V V(BR)CEO | 300MA I(C) | TO-5 |
| ECG101 | TRANSISTOR | BJT | NPN | 20V V(BR)CEO | 300MA I(C) | TO-5 |
| ECG102 | TRANSISTOR | BJT | PNP | 16V V(BR)CEO | 300MA I(C) | TO-5 |
| ECG102A | TRANSISTOR | BJT | PNP | 32V V(BR)CEO | 500MA I(C) | TO-1 |
| ECG103 | TRANSISTOR | BJT | NPN | 16V V(BR)CEO | 250MA I(C) | TO-5 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ECG099B | 制造商:WJCI 制造商全称:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| ECG10 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | BJT | NPN | 12V V(BR)CEO | 70MA I(C) | TO-92 |
| ECG100 | 制造商:ECG 功能描述: |
| ECG101 | 制造商:ECG 功能描述: |
| ECG1015 | 制造商:NTE Electronics 功能描述: |
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