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参数资料
| 型号： | EFCT4434BF |
| 厂商： | PANASONIC CORP |
| 英文描述： | 4.43 MHz, CERAMIC BRF |
| 文件页数： | 6/6页 |
| 文件大小： | 607K |
| 代理商： | EFCT4434BF |
Design, Specifications are subject to change without notice.
Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
EF10
Ceramic Trap Filters
s
Test Circuit Diagram
Rg
C
CERAP
330
15 H
S.G.
1 k
V
Probe
FET
C
: Frequency counter
S.G. : Signal generator
V.
: Voltmeter
10 MW min. and 2 pF max.
Earth Terminal
Electrodes
(3.3)
3.8
+0.3
-0.2
7.8
Terminal
Electrodes
+0.5
-0.2
0.5±0.2
2.0max.
(0.3)
3
3-(1.0)(Width of Electorode)
2
1
6-R(0.2)
(1.3)
2.5±0.2
IN PUT
or
OUTPUT
IN PUT
or
OUTPUT
2.5±0.2
(7.3)
Part No.code
Date code
s
Typical Characteristics
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
10
20
30
40
Frequency (MHz)
Attenuation
(dB)
[EFCCT4504]
t1
t2
Feeding holl
fDo
Chip Component
Tape running direction
AP1
P2
P0
FE
B
W
Chip pocket
Dim.
D0
t1
t2
AB
(mm)
f1.5
0.6max. 3.0max. 4.3±0.2 8.7±0.2
+0.1
0
Dim.
W
F
E
P1
P2
P0
(mm) 16.0±0.3 7.5±0.1 1.75±0.01 8.0±0.1 2.0±0.1 4.0±0.1
T
C
E
D
r
f
B
Wt
f A
s
Dimensions for Reel in mm (not to scale)
Dim.
fA
fB
CDE
(mm)
330
80 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim.
W
T
t
r
(mm)
16.4
22.4max. 3 max.
1.0
+2.0
0
Embossed Taping
Bulk
2500pcs./reel
500pcs./bag
s
Packaging Specifications
Supplied in bulk or taped & real packing style
q
Standard packing Quantity
s
Dimensions in mm (not to scale)
Bulk Pack
q
Emboss Taping
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相关代理商/技术参数 |
参数描述 |
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| EFD01A-F | 制造商:未知厂家 制造商全称:未知厂家 功能描述:THYRISTOR MODULE|BRIDGE|HALF-CNTLD|CC|200V V(RRM) |
| EFD01A-S | 制造商:未知厂家 制造商全称:未知厂家 功能描述:THYRISTOR MODULE|BRIDGE|HALF-CNTLD|CC|200V V(RRM) |
| EFD01A-SE | 制造商:未知厂家 制造商全称:未知厂家 功能描述:THYRISTOR MODULE|BRIDGE|HALF-CNTLD|CC|200V V(RRM) |
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