参数资料
型号: EFD25-3F4
厂商: NXP Semiconductors N.V.
英文描述: EFD cores and accessories
中文描述: EFD的内核及配件
文件页数: 3/6页
文件大小: 64K
代理商: EFD25-3F4
1997 Nov 21
3
Philips Components
Product specication
EFD cores and accessories
EFD25
COIL FORMERS
General data
Winding data for EFD25 coil former with 10-pins
PARAMETER
SPECIFICATION
Coil former material
phenolformaldehyde (PF), glass-reinforced, ame retardant in accordance with
“UL 94V-0”; UL le number E167521(M)
Pin material
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature
180
°C, “IEC 85” class H
Resistance to soldering heat
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350
°C, 3.5 s
Solderability
“IEC 68-2-20”, Part 2, Test Ta, method 1
NUMBER OF
SECTIONS
WINDING
AREA
(mm2)
MINIMUM
WINDING
WIDTH
(mm)
AVERAGE
LENGTH OF
TURN
(mm)
TYPE NUMBER
1
40.2
16.4
46.4
CSH-EFD25-1S-10P
handbook, full pagewidth
MGC343
5
0.05
1.3
0.15
0
O
13.1
0
0.1
12
0
0.2
18
0
0.2
18
(16.4 min)
0
0.2
0.8
10
3.6
20
25.2 max
22.5
26.2 max
12.5
max
11.7
0.1
0
5.5
0.1
0
6.9
0
0.1
22.5
Fig.2 EFD25 coil former; 10-pins.
Dimensions in mm.
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