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参数资料
| 型号： | EFD30-3C85 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | EFD cores and accessories |
| 中文描述： | EFD的内核及配件 |
| 文件页数： | 3/6页 |
| 文件大小： | 74K |
| 代理商： | EFD30-3C85 |
1997 Nov 21
3
Philips Components
Product specication
EFD cores and accessories
EFD30
Properties of core sets under power conditions
COIL FORMERS
General data
Winding data for EFD30 coil former with 12-pins
GRADE
B (mT) at
CORE LOSS (W) at
H = 250 A/m;
f = 25 kHz;
T = 100
°C
f = 25 kHz;
= 200 mT;
T = 100
°C
f = 100 kHz;
= 100 mT;
T = 100
°C
f = 400 kHz;
=50mT;
T = 100
°C
f=1Mz;
=30mT;
T = 100
°C
f = 3 MHz;
=10mT;
T = 100
°C
3C30
≥360
≤0.50
≤0.54
3C85
≥320
≤0.74
≤0.86
3C90
≥330
≤0.50
≤0.54
3F3
≥315
≤0.54
≤0.91
3F4
≥300
≤1.00
≤1.60
PARAMETER
SPECIFICATION
Coil former material
phenolformaldehyde (PF), glass-reinforced, ame retardant in accordance with
“UL 94V-0”; UL le number E167521(M)
Pin material
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
Maximum operating temperature
180
°C, “IEC 85” class H
Resistance to soldering heat
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350
°C, 3.5 s
Solderability
“IEC 68-2-20”, Part 2, Test Ta, method 1: 235
°C, 2 s
NUMBER OF
SECTIONS
WINDING
AREA
(mm2)
MINIMUM
WINDING
WIDTH
(mm)
AVERAGE
LENGTH OF
TURN
(mm)
TYPE NUMBER
1
52.3
20.1
52.9
CSH-EFD30-1S-12P
B
B
B
B
B
Fig.2 EFD30 coil former; 12-pins.
Dimensions in mm.
handbook, full pagewidth
MGC184
5
0.05
1.3
0.15
0
O
16.4
0
0.15
12
0
0.2
21.55
0
0.2
21.7
(20.1 min)
0
0.2
0.8
5
3.6
15
25.2 max
27.5
31.2 max
12.5
max
14.95
0.15
0
5.2
0.1
0
6.6
0
0.1
27.5
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相关代理商/技术参数 |
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| EFD30-3C90 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:EFD cores and accessories |
| EFD30-3C90-A160 | 制造商:FERROXCUBE 制造商全称:Ferroxcube International Holding B.V. 功能描述:EFD cores and accessories |
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| EFD30-3C90-A400 | 制造商:FERROXCUBE 制造商全称:Ferroxcube International Holding B.V. 功能描述:EFD cores and accessories |
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