参数资料
| 型号： | EFM32G232F64 |
| 厂商： | Energy Micro |
| 文件页数： | 59/66页 |
| 文件大小： | 0K |
| 描述： | IC MCU 32BIT 64KB FLASH LQFP64 |
| 标准包装： | 1,000 |
| 系列： | Gecko |
| 核心处理器： | ARM? Cortex?-M3 |
| 芯体尺寸： | 32-位 |
| 速度： | 32MHz |
| 连通性： | I²C，IrDA，智能卡，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，DMA，POR，PWM，WDT |
| 输入/输出数： | 53 |
| 程序存储器容量： | 64KB（64K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 16K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.8 V |
| 数据转换器： | A/D 8x12b，D/A 1x12b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 64-TQFP |
| 包装： | 带卷 (TR) |
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...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G232FXX - d0069_Rev1.60
62
www.energymicro.com
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 11
3.5. Transition between Energy Modes .................................................................................................... 18
3.6. Power Management ....................................................................................................................... 18
3.7. Flash .......................................................................................................................................... 19
3.8. General Purpose Input Output ......................................................................................................... 20
3.9. Oscillators .................................................................................................................................... 27
3.10. Analog Digital Converter (ADC) ...................................................................................................... 32
3.11. Digital Analog Converter (DAC) ...................................................................................................... 41
3.12. Analog Comparator (ACMP) .......................................................................................................... 43
3.13. Voltage Comparator (VCMP) ......................................................................................................... 45
3.14. Digital Peripherals ....................................................................................................................... 45
4. Pinout and Package ................................................................................................................................. 47
4.1. Pinout ......................................................................................................................................... 47
4.2. Alternate functionality pinout ............................................................................................................ 49
4.3. GPIO pinout overview .................................................................................................................... 52
4.4. TQFP64 Package .......................................................................................................................... 53
5. PCB Layout and Soldering ........................................................................................................................ 55
5.1. Recommended PCB Layout ............................................................................................................ 55
5.2. Soldering Information ..................................................................................................................... 57
6. Chip Marking, Revision and Errata .............................................................................................................. 58
6.1. Chip Marking ................................................................................................................................ 58
6.2. Revision ...................................................................................................................................... 58
6.3. Errata ......................................................................................................................................... 58
7. Revision History ...................................................................................................................................... 59
7.1. Revision 1.60 ............................................................................................................................... 59
7.2. Revision 1.50 ............................................................................................................................... 59
7.3. Revision 1.40 ............................................................................................................................... 59
7.4. Revision 0.90 ............................................................................................................................... 59
A. Disclaimer and Trademarks ....................................................................................................................... 60
A.1. Disclaimer ................................................................................................................................... 60
A.2. Trademark Information ................................................................................................................... 60
B. Contact Information ................................................................................................................................. 61
B.1. Energy Micro Corporate Headquarters .............................................................................................. 61
B.2. Global Contacts ............................................................................................................................ 61
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EFM32G232F64-QFP64 | 制造商:Energy Micro AS 功能描述:GECKO MCU - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 64TQFP |
| EFM32G232F64-QFP64T | 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays |
| EFM32G232F64-QFP64-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 64TQFP |
| EFM32G232F64-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 64TQFP |
| EFM32G280F128 | 功能描述:ARM微控制器 - MCU 128KB FLASH 16KB RAM 32MHZ 1.8-3.8V RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
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