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参数资料
| 型号： | EFM32G840F32 |
| 厂商： | Energy Micro |
| 文件页数： | 63/69页 |
| 文件大小： | 0K |
| 描述： | MCU 32BIT 32KB FLASH 64-QFN |
| 标准包装： | 1,000 |
| 系列： | Gecko |
| 核心处理器： | ARM? Cortex?-M3 |
| 芯体尺寸： | 32-位 |
| 速度： | 32MHz |
| 连通性： | EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，DMA，LCD，POR，PWM，WDT |
| 输入/输出数： | 56 |
| 程序存储器容量： | 32KB（32K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 8K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.8 V |
| 数据转换器： | A/D 8x12b，D/A 2x12b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 64-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 其它名称： | EFM32G840F32-QFN64 |
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...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G840FXX - d0008_Rev1.60
66
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G840 Memory Map with largest RAM and Flash sizes .......................................................................... 8
28MHz ..................................................................................................................................................... 12
21MHz ..................................................................................................................................................... 12
14MHz ..................................................................................................................................................... 13
11MHz ..................................................................................................................................................... 13
7MHz ....................................................................................................................................................... 14
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 14
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 15
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 15
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 16
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 16
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 17
3.12. EM3 current consumption. ................................................................................................................... 17
3.13. EM4 current consumption. ................................................................................................................... 18
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 29
3.21. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.22. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.23. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.24. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 32
3.25. Integral Non-Linearity (INL) ................................................................................................................... 36
3.26. Differential Non-Linearity (DNL) .............................................................................................................. 37
3.27. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 38
3.28. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 39
3.29. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 40
3.30. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 41
3.31. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 41
3.32. Typical ACMP Characteristics ............................................................................................................... 44
4.1. EFM32G840 Pinout (top view, not to scale) ............................................................................................... 48
4.2. QFN64 ................................................................................................................................................ 54
5.1. QFN64 PCB Land Pattern ...................................................................................................................... 56
5.2. QFN64 PCB Solder Mask ....................................................................................................................... 57
5.3. QFN64 PCB Stencil Design .................................................................................................................... 58
6.1. Example Chip Marking ........................................................................................................................... 59
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EFM32G840F32-QFN64 | 制造商:Energy Micro AS 功能描述:MCU, 32K FLASH, LCD 4X24, USART+UART 3, BGA112 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 64QFN |
| EFM32G840F32-QFN64T | 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays |
| EFM32G840F32-QFN64-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 64QFN |
| EFM32G840F32-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 64QFN |
| EFM32G840F64 | 功能描述:ARM微控制器 - MCU 64KB FLASH 16KB RAM 32MHZ 1.8-3.8V RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
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