参数资料
型号: EFM32G842F32
厂商: Energy Micro
文件页数: 60/67页
文件大小: 0K
描述: IC MCU 32BIT 32KB FLASH LQFP64
标准包装: 1,000
系列: Gecko
核心处理器: ARM? Cortex?-M3
芯体尺寸: 32-位
速度: 32MHz
连通性: I²C,IrDA,智能卡,SPI,UART/USART
外围设备: 欠压检测/复位,DMA,LCD,POR,PWM,WDT
输入/输出数: 53
程序存储器容量: 32KB(32K x 8)
程序存储器类型: 闪存
RAM 容量: 8K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.8 V
数据转换器: A/D 8x12b,D/A 2x12b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 64-TQFP
包装: 带卷 (TR)
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G842FXX - d0070_Rev1.60
63
www.energymicro.com
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 11
3.5. Transition between Energy Modes .................................................................................................... 18
3.6. Power Management ....................................................................................................................... 18
3.7. Flash .......................................................................................................................................... 19
3.8. General Purpose Input Output ......................................................................................................... 20
3.9. Oscillators .................................................................................................................................... 27
3.10. Analog Digital Converter (ADC) ...................................................................................................... 32
3.11. Digital Analog Converter (DAC) ...................................................................................................... 41
3.12. Analog Comparator (ACMP) .......................................................................................................... 43
3.13. Voltage Comparator (VCMP) ......................................................................................................... 45
3.14. LCD .......................................................................................................................................... 46
3.15. Digital Peripherals ....................................................................................................................... 46
4. Pinout and Package ................................................................................................................................. 48
4.1. Pinout ......................................................................................................................................... 48
4.2. Alternate functionality pinout ............................................................................................................ 50
4.3. GPIO pinout overview .................................................................................................................... 54
4.4. TQFP64 Package .......................................................................................................................... 54
5. PCB Layout and Soldering ........................................................................................................................ 56
5.1. Recommended PCB Layout ............................................................................................................ 56
5.2. Soldering Information ..................................................................................................................... 58
6. Chip Marking, Revision and Errata .............................................................................................................. 59
6.1. Chip Marking ................................................................................................................................ 59
6.2. Revision ...................................................................................................................................... 59
6.3. Errata ......................................................................................................................................... 59
7. Revision History ...................................................................................................................................... 60
7.1. Revision 1.60 ............................................................................................................................... 60
7.2. Revision 1.50 ............................................................................................................................... 60
7.3. Revision 1.40 ............................................................................................................................... 60
7.4. Revision 0.90 ............................................................................................................................... 60
A. Disclaimer and Trademarks ....................................................................................................................... 61
A.1. Disclaimer ................................................................................................................................... 61
A.2. Trademark Information ................................................................................................................... 61
B. Contact Information ................................................................................................................................. 62
B.1. Energy Micro Corporate Headquarters .............................................................................................. 62
B.2. Global Contacts ............................................................................................................................ 62
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