参数资料
型号: EFM32LG280F256
厂商: Energy Micro
文件页数: 53/69页
文件大小: 0K
描述: IC MCU 32BIT 256KB FLASH QFP100
标准包装: 1,000
系列: Leopard Gecko
核心处理器: ARM? Cortex?-M4
芯体尺寸: 32-位
速度: 48MHz
连通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外围设备: 欠压检测/复位,DMA,POR,PWM,WDT
输入/输出数: 86
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 容量: 32K x 8
电压 - 电源 (Vcc/Vdd): 1.85 V ~ 3.8 V
数据转换器: A/D 8x12b,D/A 2x12b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
包装: 带卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG280FXX - d0107_Rev1.10
57
www.energymicro.com
3. Dimension 'D1' and 'E1' do not include mold protrusions. Allowable protrusion is 0.25 per side. Di-
mensions 'D1' and 'E1' do include mold mismatch and are determined at datum plane datum 'H'.
4. Dimension 'b' does not include dambar protrusion. Allowable dambar protrusion shall not cause the
lead width to exceed the maximum 'b' dimension by more than 0.08 mm. Dambar can not be located
on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm
5. Exact shape of each corner is optional.
Table 4.4. LQFP100 (Dimensions in mm)
SYMBOL
MIN
NOM
MAX
total thickness
A
--
1.6
stand off
A1
0.05
--
0.15
mold thickness
A2
1.35
1.4
1.45
lead width (plating)
b
0.17
0.2
0.27
lead width
b1
0.17
--
0.23
L/F thickness (plating)
c
0.09
--
0.2
lead thickness
c1
0.09
--
0.16
x
D
16 BSC
y
E
16 BSC
x
D1
14 BSC
body size
y
E1
14 BSC
lead pitch
e
0.5 BSC
L
0.45
0.6
0.75
footprint
L1
1 REF
θ
3.5°
θ1
--
θ2
11°
12°
13°
θ3
11°
12°
13°
R1
0.08
--
R1
0.08
--
0.2
S
0.2
--
package edge tolerance
aaa
0.2
lead edge tolerance
bbb
0.2
coplanarity
ccc
0.08
lead offset
ddd
0.08
mold flatness
eee
0.05
The LQFP100 Package uses Nickel-Palladium-Gold preplated leadframe.
All EFM32 packages are RoHS compliant and free of Bromine (Br) and Antimony (Sb).
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