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参数资料
| 型号： | EFOLMFREQ1B0 |
| 厂商： | PANASONIC CORP |
| 元件分类： | 陶瓷谐振器 |
| 英文描述： | CERAMIC RESONATOR, 16 MHz - 20 MHz |
| 封装： | ROHS COMPLIANT, CERAMIC PACKAGE-2 |
| 文件页数： | 1/4页 |
| 文件大小： | 247K |
| 代理商： | EFOLMFREQ1B0 |
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ceramic Resonators, Chip Type
– EC171 –
Ce
ra
mic
R
e
son
a
to
rs
,
Chip
T
y
pe
E
F
O
4004
Product Code
Ceramic
Resonators
EFO
Nominal Oscillation
Frequency
4004
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
Type
Chip Type with 2-terminals
PM
LM
PS
DM
4to13MHz
16 to 20 MHz
30 to 50 MHz
4to13MHz
12 to 20 MHz
4.00 MHz
(Example)
123456789
10
11
12
1695
4005
16.93 MHz
40.0 MHz
E
F
O
3584
Product Code
Ceramic
Resonators
EFO
Frequency
Tolerance
±1.0 %
±0.3 %
±0.5 %
0
3
5
Design No.
Packaging Style
B
E
Bulk Pack
Embossed
Taping
123456789
10
11
12
Nominal Oscillation
Frequency
3584
Type
Chip Type with 2-terminals
P
D
2to13MHz
13.1 to 20 MHz
3.58 MHz
(Example)
1695
16.93 MHz
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
Ceramic Resonators, Chip Type
(2 Array Type)
Type:
EFOP
Type:
EFOD
Type:
EFOPS
Type:
EFOPM
Type:
EFODM
Type:
EFOLM
■ Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum in thickness (PS/PM/DM/LM)
● Designed for reow soldering
● Flat-bottom plate for better mounting
● RoHS compliant
■ Handling Precautions (See Page 175 to 176)
■ Explanation of Part Numbers
Part Number
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Attached Capacitors
(Reference)
EFOP
2.00 to 8.39
±0.3 %
33 pF
8.40 to 13.0
±1.0 %
EFOD
13.1 to 20.0
±1.0 %
33 pF
EFOPS
4.00 to 8.39
±0.6 %
21 pF
8.40 to 13.0
±1.0 %
EFOPM
4.00 to 8.39
±0.3 %
33 pF
8.40 to 13.0
±1.0 %
EFODM
12.0 to 20.0
±1.0 %
18 pF
EFOLM
16.0 to 20.0
±1.0 %
10 pF
30.0 to 50.0
±0.3 %
■ Packaging Specications
See Page 174, 177
00 Apr. 2008
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