参数资料
| 型号： | EL1503ACLZ-T13 |
| 厂商： | Intersil |
| 文件页数： | 6/17页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE ADSL/HDSL2 24-QFN |
| 标准包装： | 2,500 |
| 类型： | 驱动器 |
| 驱动器/接收器数： | 2/0 |
| 规程： | DSL |
| 电源电压： | 5 V ~ 12 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-QFN（5x4） |
| 包装： | 带卷 (TR) |
14
FN7039.2
March 26, 2007
Then, the θJA requirement needs to be calculated. This is
done using the equation:
where:
TJUNCT is the maximum die temperature (150°C)
TAMB is the maximum ambient temperature
PDISS is the dissipation calculated above
θJA is the junction to ambient thermal resistance for the
package when mounted on the PCB
This θJA value is then used to calculate the area of copper
needed on the board to dissipate the power. The graph
below show various θJA for the SO20 mounted on different
copper foil areas.
A separate application note details the 24 Ld QFN PCB
design considerations.
Single Supply Operation
The EL1503A can also be powered from a single supply
voltage. When operating in this mode, the GND pins can still
be connected directly to GND. To calculate power
dissipation, the equations in the previous section should be
used, with VS equal to half the supply rail.
EL1503A PCB Design
A separate application note details the 24 Ld QFN PCB
design considerations. The SOIC power packages
(20 leads) are designed so that heat may be conducted
away from the device in an efficient manner. To disperse this
heat, the center leads (4 per side for the 20 lead and 2 per
side for the 16 lead) are internally connected to the mounting
platform of the die. Heat flows through the leads into the
circuit board copper, then spreads and convects to air. Thus,
the ground plane on the component side of the board
becomes the heatsink. This has proven to be a very effective
technique, but several aspects of board layout should be
noted. First, the heat should not be shunted to internal
copper layers of the board nor backside foil, since the
feedthroughs and fiberglass of the board are not very
thermally conductive. To obtain the best thermal resistance
of the mounted part, θJA, the topside copper ground plane
should have as much area as possible and be as thick as
practical. If possible, the solder mask should be cut away
from the EL1503A to improve thermal resistance. Finally,
metal heatsinks can be placed against the board close to the
part to draw heat toward the chassis.
Output Loading
While the drive amplifiers can output in excess of 500mA
transiently, the internal metallization is not designed to carry
more than 100mA of steady DC current and there is no
current-limit mechanism. This allows safely driving rms
sinusoidal currents of 2 X 100mA, or 200mA. This current is
more than that required to drive line impedances to large
output levels, but output short circuits cannot be tolerated.
The series output resistor will usually limit currents to safe
values in the event of line shorts. Driving lines with no series
resistor is a serious hazard.
The amplifiers are sensitive to capacitive loading. More than
25pF will cause peaking of the frequency response. The
same is true of badly terminated lines connected without a
series matching resistor.
Power Supplies
The power supplies should be well bypassed close to the
EL1503A. A 3.3F tantalum capacitor for each supply works
well. Since the load currents are differential, they should not
travel through the board copper and set up ground loops that
can return to amplifier inputs. Due to the class AB output
stage design, these currents have heavy harmonic content.
If the ground terminal of the positive and negative bypass
capacitors are connected to each other directly and then
returned to circuit ground, no such ground loops will occur.
This scheme is employed in the layout of the EL1503A
demonstration board, and documentation can be obtained
from the factory.
Feedback Resistor Value
The bandwidth and peaking of the amplifiers varies with
supply voltage somewhat and with gain settings. The
feedback resistor values can be adjusted to produce an
optimal frequency response. Here is a series of resistor
values that produce an optimal driver frequency response
(1dB peaking) for different supply voltages and gains:
θ
JA
T
JUNCT
T
AMB
–
()
P
DISS
-------------------------------------------------
=
012
9
10
678
345
55
50
45
40
35
30
FIGURE 41. THERMAL RESISTANCE of 20 Ld SOIC (0.300")
EL1503A vs BOARD COPPER AREA
MOUNTED
DEVICE
θ JA
(°C/
W)
Note: 2oz. COPPER USED
TOP FOIL ONLY-WITH SOLDER MASK
TOP FOIL-WITH 0.45IN2 BOTTOM
FOIL WITH MANY FEEDTHROUGHS
TOP FOIL ONLY-NO SOLDER MASK
AREA OF CIRCUIT BOARD HEAT SINK (in2)
TABLE 1. OPTIMUM DRIVER FEEDBACK RESISTOR for
VARIOUS GAINS and SUPPLY VOLTAGES
SUPPLY
VOLTAGE
DRIVER VOLTAGE GAIN
2.5
5
10
±5V
±12V
2.7k
2.2k
2.0k
EL1503A
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| EL1503ACLZ-T7 | 功能描述:IC INTERFACE ADSL/HDSL2 24-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1503ACM | 功能描述:IC INTERFACE ADSL/HDSL2 20-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1503ACM-T13 | 功能描述:IC INTERFACE ADSL/HDSL2 20-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1503ACMZ | 功能描述:IC INTERFACE ADSL/HDSL2 20-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1503ACMZ-T13 | 功能描述:IC INTERFACE ADSL/HDSL2 20-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
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