参数资料
型号: EL5220TILZ-T13
厂商: Intersil
文件页数: 5/15页
文件大小: 0K
描述: IC OPAMP GP R-R 12MHZ 8DFN
标准包装: 6,000
放大器类型: 电压反馈
电路数: 2
输出类型: 满摆幅
转换速率: 12 V/µs
增益带宽积: 8MHz
-3db带宽: 12MHz
电流 - 输入偏压: 2nA
电压 - 输入偏移: 5000µV
电流 - 电源: 650µA
电流 - 输出 / 通道: 65mA
电压 - 电源,单路/双路(±): 4.5 V ~ 19 V,±2.25 V ~ 9.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
供应商设备封装: 8-DFN(2x3)
包装: 带卷 (TR)
EL5220T
13
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6892.0
May 4, 2010
For additional products, see www.intersil.com/product_tree
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5220T can provide gain at high frequency, so
good printed circuit board layout is necessary for
optimum performance. Ground plane construction is
highly recommended, trace lengths should be as short
as possible and the power supply pins must be well
bypassed to reduce any risk of oscillation.
For normal single supply operation (the VS- pin is
connected to ground) a 4.7μF capacitor should be
placed from VS+ to ground, then a parallel 0.1μF
capacitor should be connected as close to the amplifier
as possible. One 4.7μF capacitor may be used for
multiple devices. For dual supply operation the same
capacitor combination should be placed at each supply
pin to ground.
It is highly recommended that EL5220T exposed
thermal pad packages should always have the pad
connected to the lowest potential, VS-, to optimize
thermal and operating performance. PCB vias should
be placed below the device’s exposed thermal pad to
transfer heat to the VS- plane and away from the
device.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The
Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: EL5220T
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
5/4/10
FN6892.0
Initial Release
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