参数资料
| 型号： | EL5625ILZ |
| 厂商： | Intersil |
| 文件页数： | 3/12页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 18XGAMMA PROG 38-QFN |
| 标准包装： | 53 |
| 应用： | TFT-LCD 面板：伽玛缓冲器，VCOM 驱动器 |
| 输出类型： | 满摆幅 |
| 电路数： | 18 |
| 电流 - 电源： | 11mA |
| 电流 - 输出 / 通道： | 130mA |
| 电压 - 电源，单路/双路(±)： | 7 V ~ 16 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 38-VFQFN 裸露焊盘 |
| 供应商设备封装： | 38-QFN（5x7）裸露焊盘 |
| 包装： | 散装 |
11
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FN7488.1
February 20, 2008
At the falling edge of the OSC, output 1 is being refreshed
and one clock cycle later, output 2 is being refreshed. The
spike you see here is the response of the output amplifier
when the refreshed switches are closed. When driving a big
capacitor load, there will be ringing at the spikes because
the phase margin of the amplifier is decreased.
The speed of the external OSC signal shouldn’t be greater
than 70kHz because for the worst condition, it will take at
least 4s to charge the sample and hold capacitor CH. The
pulse width has to be at least 4s long. From our lab test, the
duty cycle of the OSC signal must be greater than 30%.
POWER DISSIPATION
With the 100mA maximum continues output drive capability
for VCOM channel, it is possible to exceed the 125°C
absolute maximum junction temperature. Therefore, it is
important to calculate the maximum junction temperature for
the application to determine if load conditions need to be
modified for the part to remain in the safe operation.
The maximum power dissipation allowed in a package is
determined according to:
where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
θJA = Thermal resistance of the package
PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by the IC
is the total quiescent supply current times the total power
supply voltage and plus the power in the IC due to the loads.
when sourcing, and:
when sinking.
Where:
i = 18
VS = Supply voltage
IS = Quiescent current
VOUTi = Output voltage of the i channel
ILOADi = Load current of the i channel
By setting the two PDMAX equations equal to each other, we
can solve for the RLOADs to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
THERMAL SHUTDOWN
The EL5625 has an internal thermal shutdown circuitry that
prevents overheating of the part. When the junction
temperature goes up to about 150°C, the part will be
disabled. When the junction temperature drops down to
about 120°C, the part will be enabled. With this feature, any
short circuit at the outputs will enable the thermal shutdown
circuitry to disable the part.
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5625. The traces from the
two ground pins to the ground plane must be very short. The
thermal pad of the EL5625 should be connected to the
analog ground plane. Lead length should be as short as
possible and all power supply pins must be well bypassed. A
0.1F ceramic capacitor must be place very close to the VS,
VREFH, VREFL, and CAP pins. A 4.7F local bypass
tantalum capacitor should be placed to the VS, VREFH, and
VREFL pins.
P
DMAX
T
JMAX - TAMAX
Θ
JA
---------------------------------------------
=
P
DMAX
V
S
I
S
Σ V
S
(
- V
OUTi )
I
LOADi
×
[]
+
×
=
P
DMAX
V
S
I
S
Σ V
OUTiILOADi
×
()
+
×
=
EL5625
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