参数资料
型号: EL7564CRE
厂商: Intersil
文件页数: 6/17页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 4A 28HTSSOP
标准包装: 50
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1 V ~ 3.8 V
输入电压: 4.5 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 1MHz
电流 - 输出: 4A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 28-TSSOP 裸露焊盘
EL7564
Typical Performance Curves (Continued)
2
1.6
V IN =5V
V O =3.3V
1.8
1.6
1.4
1.2
V O =2.8V
1.2
1
V O =3.3V
0.8
0.4
V O =1.8V
0.8
0.6
0.4
V O =1.8V
0.2
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
3.5
4
OUTPUT CURRENT I O (A)
FIGURE 3. EL7564CM TOTAL CONVERTER POWER LOSS
I O (A)
FIGURE 4. EL7564CRE TOTAL CONVERTER POWER LOSS
3.325
3.315
3.305
V O =3.3V
V IN =5.5V
1.5
1
0.5
0
V O =3.3V
V IN =4.5V
V IN =5V
3.295
3.285
V IN =5V
V IN =4.5V
-0.5
-1
V IN =5.5V
3.275
0.5
1
1.5
2
2.5
3
3.5
4
-1.5
0
1
2
3
4
LOAD CURRENT I O (A)
FIGURE 5. EL7564CM LOAD REGULATION
TEST CONDITION:
CHIP IN THE CENTER OF COPPER AREA
50
46
WITH NO AIRFLOW
42
38
WITH 100 LFPM AIRFLOW
34
1 OZ. COPPER PCB USED
30
I O (A)
FIGURE 6. EL7564CRE LOAD REGULATION
CONDITION:
EL7564RE THERMAL PAD SOLDERED TO 2-LAYER
PCB WITH 0.039” THICKNESS AND 1 OZ. COPPER
ON BOTH SIDES
50
45
40
35
30
25
1
1.5
2
2.5
3
3.5
4
1
1.5
2
2.5
3
3.5
4
PCB COPPER HEAT-SINKING AREA (in 2 )
FIGURE 7. EL7564CM θ JA vs COPPER AREA
6
PCB AREA (in 2 )
FIGURE 8. EL7564CRE THERMAL RESISTANCE vs PCB
AREA - NO AIRFLOW
FN7297.3
May 9, 2005
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