参数资料
| 型号： | EL7585AILZ-T13 |
| 厂商： | Intersil |
| 文件页数： | 17/19页 |
| 文件大小： | 0K |
| 描述： | IC POWER SUPPLY TFT-LCD 20-QFN |
| 标准包装： | 2,500 |
| 应用： | 转换器，TFT，LCD |
| 输入电压： | 3 V ~ 5 V |
| 输出数： | 4 |
| 输出电压： | 5.5 V ~ 20 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN 裸露焊盘（4x4） |
| 包装： | 带卷 (TR) |
EL7585A
Over-Temperature Protection
An internal temperature sensor continuously monitors the
die temperature. In the event that the die temperature
exceeds the thermal trip point of 140°C, the device will shut
down.
Layout Recommendation
The device's performance including efficiency, output noise,
transient response and control loop stability is dramatically
affected by the PCB layout. PCB layout is critical, especially
at high switching frequency.
There are some general guidelines for layout:
1. Place the external power components (the input
capacitors, output capacitors, boost inductor and output
diodes, etc.) in close proximity to the device. Traces to
these components should be kept as short and wide as
possible to minimize parasitic inductance and resistance.
2. Place V REF and V DD bypass capacitors close to the pins.
3. Minimize the length of traces carrying fast signals and
high current.
4. All feedback networks should sense the output voltage
directly from the point of load, and be as far away from LX
node as possible.
5. The power ground (PGND) and signal ground (SGND)
pins should be connected at only one point near the main
decoupling capacitors.
Demo Board Layout
FIGURE 27. TOP LAYER
17
6. The exposed die plate, on the underneath of the
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
7. To minimize the thermal resistance of the package when
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
8. A signal ground plane, separate from the power ground
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for feedback resistor networks (R 1 , R 11 ,
R 41 ) and the V REF capacitor, C 22 , the C DELAY capacitor
C 7 and the integrator capacitor C 23 .
9. Minimize feedback input track lengths to avoid switching
noise pick-up.
A two-layer demo board is available to illustrate the proper
layout implementation. A four-layer demo board can be used
to further optimize the layout recommendations.
FIGURE 28. BOTTOM LAYER
FN7523.3
March 9, 2006
相关PDF资料 |
PDF描述 |
|---|---|
| HSM24DRXH | CONN EDGECARD 48POS DIP .156 SLD |
| EL7585AILZ | IC POWER SUPPLY TFT-LCD 20-QFN |
| AVS107M25E16B-F | CAP ALUM 100UF 25V 20% SMD |
| AHA476M35E16B-F | CAP ALUM 47UF 35V 20% SMD |
| EL7584IRZ-T13 | IC CONV DC/DC 4-CHAN 24-TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EL7585AILZ-T7 | 功能描述:IC POWER SUPPLY TFT-LCD 20-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| EL7585AP_06 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TFT-LCD Power Supply |
| EL7585IL | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TFT-LCD Power Supply |
| EL7585IL-T13 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TFT-LCD Power Supply |
| EL7585IL-T7 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TFT-LCD Power Supply |
发布紧急采购，3分钟左右您将得到回复。