参数资料
型号: EL8176FSZ-T7
厂商: Intersil
文件页数: 10/18页
文件大小: 0K
描述: IC OPAMP SGL R-R I/O 8-SOIC
标准包装: 1,000
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 0.13 V/µs
增益带宽积: 400kHz
-3db带宽: 1MHz
电流 - 输入偏压: 500pA
电压 - 输入偏移: 25µV
电流 - 电源: 55µA
电流 - 输出 / 通道: 31mA
电压 - 电源,单路/双路(±): 2.4 V ~ 5.5 V,±1.2 V ~ 2.75 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
18
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7436.8
April 3, 2009
EL8176
Wafer Level Chip Scale Package (WLCSP)
PIN 1 ID
A
E1
BOTTOM VIEW
CB
A
b
D1
SIDE VIEW
A1
A2
TOP VIEW
D
E
SD
2
1
e
SE
b
W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL
MILLIMETERS
A
0.51 Min, 0.55 Max
A1
0.225 ±0.015
A2
0.305 ±0.013
b
Φ0.323 ±0.025
D
0.955 ±0.020
D1
0.50 BASIC
E
1.455 ±0.020
E1
1.00 BASIC
e
0.50 BASIC
SD
0.25 BASIC
SE
0.00 BASIC
Rev. 3 03/08
NOTES:
1. All dimensions are in millimeters.
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