参数资料
| 型号： | EP1AGX20CF484I6 |
| 厂商： | Altera |
| 文件页数： | 2/4页 |
| 文件大小： | 0K |
| 描述： | IC ARRIA GX FPGA 20K 484FBGA |
| 产品培训模块： | Three Reasons to Use FPGA's in Industrial Designs |
| 标准包装： | 60 |
| 系列： | Arria GX |
| LAB/CLB数： | 1079 |
| 逻辑元件/单元数： | 21580 |
| RAM 位总计： | 1229184 |
| 输入/输出数： | 230 |
| 电源电压： | 1.15 V ~ 1.25 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 484-BGA |
| 供应商设备封装： | 484-FBGA（23x23） |
1–2
Chapter 1: Arria GX Device Family Overview
Features
Arria GX Device Handbook, Volume 1
December 2009
Altera Corporation
■
Main device features:
■
TriMatrix memory consisting of three RAM block sizes to implement true
dual-port memory and first-in first-out (FIFO) buffers with performance up to
380 MHz
■
Up to 16 global clock networks with up to 32 regional clock networks per
device
■
High-speed DSP blocks provide dedicated implementation of multipliers,
multiply-accumulate functions, and finite impulse response (FIR) filters
■
Up to four enhanced phase-locked loops (PLLs) per device provide spread
spectrum, programmable bandwidth, clock switch-over, and advanced
multiplication and phase shifting
■
Support for numerous single-ended and differential I/O standards
■
High-speed source-synchronous differential I/O support on up to 47 channels
■
Support for source-synchronous bus standards, including SPI-4 Phase 2
(POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
■
Support for high-speed external memory including DDR and DDR2 SDRAM,
and SDR SDRAM
■
Support for multiple intellectual property megafunctions from Altera
MegaCore functions and Altera Megafunction Partners Program (AMPPSM)
■
Support for remote configuration updates
Table 1–1 lists Arria GX device features for FineLine BGA (FBGA) with flip chip
packages.
Table 1–1. Arria GX Device Features (Part 1 of 2)
Feature
EP1AGX20C
EP1AGX35C/D
EP1AGX50C/D
EP1AGX60C/D/E
EP1AGX90E
C
CDC
D
C
D
E
Package
484-pin,
780-pin
(Flip chip)
484-pin
(Flip chip)
780-pin
(Flip chip)
484-pin
(Flip chip)
780-pin,
1152-pin
(Flip chip)
484-pin
(Flip chip)
780-pin
(Flip chip)
1152-pin
(Flip chip)
1152-pin
(Flip chip)
ALMs
8,632
13,408
20,064
24,040
36,088
Equivalent
logic
elements
(LEs)
21,580
33,520
50,160
60,100
90,220
Transceiver
channels
4
848
4
8
12
Transceiver
data rate
600 Mbps
to 3.125
Gbps
600 Mbps to 3.125
Gbps
600 Mbps to 3.125
Gbps
600 Mbps to 3.125 Gbps
600 Mbps
to 3.125
Gbps
Source-
synchronous
receive
channels
31
31, 42
31
42
47
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EP1AGX20CF484I6N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria GX 1079 LABs 230 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP1AGX20CF780C6 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria GX 1079 LABs 341 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP1AGX20CF780C6N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria GX 1079 LABs 341 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP1AGX20CF780I6 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria GX 1079 LABs 341 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EP1AGX20CF780I6N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria GX 1079 LABs 341 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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