参数资料
型号: EP20K200EFC484-2XN
厂商: Altera
文件页数: 34/117页
文件大小: 0K
描述: IC APEX 20KE FPGA 200K 484-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: APEX-20K®
LAB/CLB数: 832
逻辑元件/单元数: 8320
RAM 位总计: 106496
输入/输出数: 376
门数: 404000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 484-BGA
供应商设备封装: 484-FBGA(23x23)
Altera Corporation
23
APEX 20K Programmable Logic Device Family Data Sheet
Figure 11 shows the intersection of a row and column interconnect, and
how these forms of interconnects and LEs drive each other.
Figure 11. Driving the FastTrack Interconnect
APEX 20KE devices include an enhanced interconnect structure for faster
routing of input signals with high fan-out. Column I/O pins can drive the
FastRow interconnect, which routes signals directly into the local
interconnect without having to drive through the MegaLAB interconnect.
FastRow lines traverse two MegaLAB structures. Also, these pins can
drive the local interconnect directly for fast setup times. On EP20K300E
and larger devices, the FastRow interconnect drives the two MegaLABs in
the top left corner, the two MegaLABs in the top right corner, the two
MegaLABS in the bottom left corner, and the two MegaLABs in the
bottom right corner. On EP20K200E and smaller devices, FastRow
interconnect drives the two MegaLABs on the top and the two MegaLABs
on the bottom of the device. On all devices, the FastRow interconnect
drives all local interconnect in the appropriate MegaLABs except the local
interconnect on the side of the MegaLAB opposite the ESB. Pins using the
FastRow interconnect achieve a faster set-up time, as the signal does not
need to use a MegaLAB interconnect line to reach the destination LE.
Figure 12 shows the FastRow interconnect.
Row Interconnect
MegaLAB Interconnect
LE
Column
Interconnect
Local
Interconnect
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EP20K200EFC484-3ES 制造商:未知厂家 制造商全称:未知厂家 功能描述:FPGA
EP20K200EFC484-3N 功能描述:FPGA - 现场可编程门阵列 CPLD - APEX 20K 832 Macro 376 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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