参数资料
型号: EP20K30ETC144-3N
厂商: Altera
文件页数: 63/117页
文件大小: 0K
描述: IC APEX 20KE FPGA 300K 144-TQFP
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 60
系列: APEX-20K®
LAB/CLB数: 120
逻辑元件/单元数: 1200
RAM 位总计: 24576
输入/输出数: 92
门数: 113000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
Altera Corporation
5
APEX 20K Programmable Logic Device Family Data Sheet
Notes to Tables 4 and 5:
(1)
I/O counts include dedicated input and clock pins.
(2)
APEX 20K device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), power quad flat
pack (RQFP), 1.27-mm pitch ball-grid array (BGA), 1.00-mm pitch FineLine BGA, and pin-grid array (PGA)
packages.
(3)
This device uses a thermally enhanced package, which is taller than the regular package. Consult the Altera Device
Package Information Data Sheet for detailed package size information.
Table 5. APEX 20K FineLine BGA Package Options & I/O Count
Device
144 Pin
324 Pin
484 Pin
672 Pin
1,020 Pin
EP20K30E
93
128
EP20K60E
93
196
EP20K100
252
EP20K100E
93
246
EP20K160E
316
EP20K200
382
EP20K200E
376
EP20K300E
408
EP20K400
502 (3)
EP20K400E
488 (3)
EP20K600E
508 (3)
588
EP20K1000E
508 (3)
708
EP20K1500E
808
Table 6. APEX 20K QFP, BGA & PGA Package Sizes
Feature
144-Pin TQFP 208-Pin QFP 240-Pin QFP 356-Pin BGA 652-Pin BGA 655-Pin PGA
Pitch (mm)
0.50
1.27
Area (mm2)
484
924
1,218
1,225
2,025
3,906
Length
× Width
(mm
× mm)
22
× 22
30.4
× 30.4
34.9
× 34.9
35
× 35
45
× 45
62.5
× 62.5
Table 7. APEX 20K FineLine BGA Package Sizes
Feature
144 Pin
324 Pin
484 Pin
672 Pin
1,020 Pin
Pitch (mm)
1.00
Area (mm2)
169
361
529
729
1,089
Length
× Width (mm × mm)
13
× 13
19
× 19
23
× 23
27
× 27
33
× 33
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