参数资料
型号: EP2AGX65DF29I5
厂商: Altera
文件页数: 8/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 65K 780FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 4
系列: Arria II GX
LAB/CLB数: 2530
逻辑元件/单元数: 60214
RAM 位总计: 5371904
输入/输出数: 364
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 780-BBGA
供应商设备封装: 780-FBGA(29x29)
1–8
Chapter 1: Device Datasheet for Arria II Devices
Electrical Characteristics
December 2013
Altera Corporation
I/O Pin Leakage Current
Table 1–7 lists the Arria II GX I/O pin leakage current specifications.
Table 1–8 lists the Arria II GZ I/O pin leakage current specifications.
Bus Hold
Bus hold retains the last valid logic state after the source driving it either enters the
high impedance state or is removed. Each I/O pin has an option to enable bus hold in
user mode. Bus hold is always disabled in configuration mode.
Table 1–9 lists bus hold specifications for Arria II GX devices.
Table 1–7. I/O Pin Leakage Current for Arria II GX Devices
Symbol
Description
Conditions
Min
Typ
Max
Unit
II
Input pin
VI = 0 V to VCCIOMAX
–10
10
A
IOZ
Tri-stated I/O pin
VO = 0 V to VCCIOMAX
–10
10
A
Table 1–8. I/O Pin Leakage Current for Arria II GZ Devices
Symbol
Description
Conditions
Min
Typ
Max
Unit
II
Input pin
VI = 0 V to VCCIOMAX
–20
20
A
IOZ
Tri-stated I/O pin
VO = 0 V to VCCIOMAX
–20
20
A
Table 1–9. Bus Hold Parameters for Arria II GX Devices (Note 1)
Parameter
Symbol
Cond.
VCCIO (V)
Unit
1.2
1.5
1.8
2.5
3.0
3.3
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Bus-hold
low,
sustaining
current
ISUSL
VIN > VIL
(max.)
8
12
30—50
70
70
A
Bus-hold
high,
sustaining
current
ISUSH
VIN < VIL
(min.)
–8
–12
–30
–50
–70
–70
A
Bus-hold
low,
overdrive
current
IODL
0V <VIN <
VCCIO
125
175
200
300
500
500
A
Bus-hold
high,
overdrive
current
IODH
0V <VIN <
VCCIO
–125
–175
–200
–300
–500
–500
A
Bus-hold
trip point
VTRIP
0.3
0.9
0.375
1.125
0.68
1.07
0.7
1.7
0.8
2
0.8
2
V
Note to Table 1–9:
(1) The bus-hold trip points are based on calculated input voltages from the JEDEC standard.
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EP2AGX65DF29I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C4 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256