参数资料
型号: EPC9001
厂商: EPC
文件页数: 2/7页
文件大小: 0K
描述: BOARD DEV FOR EPC2015 40V GAN
应用说明: Thermal Performance of eGaN® FETs
Assembling eGaN® FETS
Using eGaN® FETs
产品培训模块: eGaN™ Basics
eGaN™ Power Transistors Characteristics
Drivng eGaN™ Power Transistors
eGaN FETs for DC-DC Conversion
RoHS指令信息: Lead Free/RoHS Statement
设计资源: EPC9001 Schematic
EPC9001 Gerber Files
EPC9001 Bill of Materials
特色产品: EPC Development Tools
标准包装: 1
系列: eGaN®
主要目的: 电源管理,半 H 桥驱动器(外部 FET)
嵌入式:
已用 IC / 零件: EPC2015
主要属性: 40V、15A 最大输出 GaNFET 功率
次要属性: GaNFET 驱动器电路,采用 7 ~ 12V 电压
已供物品:
产品目录页面: 1139 (CN2011-ZH PDF)
工具箱内容: (2) 917-1019-1-ND - TRANS GAN 40V 33A BUMPED DIE
其它名称: 917-1010
DESCRIPTION
The EPC9001 development board is a 40 V maximum device volt-
age, 15 A maximum output current, half bridge with onboard gate
drives, featuring the EPC2015 enhancement mode ( eGaN ?) field
effect transistor (FET). The purpose of this development board is
to simplify the evaluation process of the EPC2015 eGaN FET by in-
cluding all the critical components on a single board that can be
www.epc-co.com
the Texas Instruments LM5113 gate driver, supply and bypass ca-
pacitors. The board contains all critical components and layout
for optimal switching performance. There are also various probe
points to facilitate simple waveform measurement and efficien-
cy calculation. A complete block diagram of the circuit is given
in Figure 1.
easily connected into any existing converter.
For more information on the EPC2015s eGaN FET please refer to
The EPC9001 development board is 2” x 1.5” and contains not
only two EPC2015 eGaN FET in a half bridge configuration using
Table 1: Performance Summary (TA = 25°C)
the datasheet available from EPC at www.epc-co.com. The data-
sheet should be read in conjunction with this quick start guide.
SYMBOL PARAMETER
CONDITIONS
MIN
MAX
UNITS
V DD
V IN
V OUT
I OUT
Gate Drive Input Supply Range
Bus Input Voltage Range
Switch Node Output Voltage
Switch Node Output Current
7
12
28*
40
15*
V
V
V
A
V PWM
PWM Logic Input Voltage Threshold
Minimum ‘High’ State Input Pulse Width
Minimum ‘Low’ State Input Pulse Width
Input ‘High’
Input ‘Low’
V PWM rise and fall time < 10ns
V PWM rise and fall time < 10ns
3.5
0
60
200 #
6
1.5
V
V
ns
ns
* Assumes inductive load, maximum current depends on die temperature – actual maximum current with be subject to switching frequency, bus voltage and thermals.
# Limited by time needed to ‘refresh’ high side bootstrap supply voltage.
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