参数资料
型号: EPF10K30ETC144-1
厂商: Altera
文件页数: 50/100页
文件大小: 0K
描述: IC FLEX 10KE FPGA 30K 144-TQFP
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 180
系列: FLEX-10KE®
LAB/CLB数: 216
逻辑元件/单元数: 1728
RAM 位总计: 24576
输入/输出数: 102
门数: 119000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
其它名称: 544-2226
Altera Corporation
53
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Timing simulation and delay prediction are available with the Altera
Simulator and Timing Analyzer, or with industry-standard EDA tools.
The Simulator offers both pre-synthesis functional simulation to evaluate
logic design accuracy and post-synthesis timing simulation with 0.1-ns
resolution. The Timing Analyzer provides point-to-point timing delay
information, setup and hold time analysis, and device-wide performance
analysis.
Figure 24 shows the overall timing model, which maps the possible paths
to and from the various elements of the FLEX 10KE device.
Figure 24. FLEX 10KE Device Timing Model
Figures 25 through 28 show the delays that correspond to various paths
and functions within the LE, IOE, EAB, and bidirectional timing models.
Dedicated
Clock/Input
Interconnect
I/O Element
Logic
Element
Embedded Array
Block
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相关代理商/技术参数
参数描述
EPF10K30ETC144-1 RFB 制造商:Altera Corporation 功能描述:
EPF10K30ETC144-1DX 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
EPF10K30ETC144-1N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30ETC144-1X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30ETC144-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 102 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256