参数资料
型号: EPM7064AETC100-4N
厂商: Altera
文件页数: 7/64页
文件大小: 0K
描述: IC MAX 7000 CPLD 64 100-TQFP
产品变化通告: Bond Wire Change 4/Sept/2008
标准包装: 270
系列: MAX® 7000A
可编程类型: 系统内可编程
最大延迟时间 tpd(1): 4.5ns
电压电源 - 内部: 3 V ~ 3.6 V
逻辑元件/逻辑块数目: 4
宏单元数: 64
门数: 1250
输入/输出数: 68
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 100-TQFP
供应商设备封装: 100-TQFP(14x14)
包装: 托盘
其它名称: 544-2580
EPM7064AETC100-4N-ND
Altera Corporation
15
MAX 7000A Programmable Logic Device Data Sheet
SameFrame
Pin-Outs
MAX 7000A devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPM7128AE device in a 100-pin
FineLine BGA package to an EPM7512AE device in a 256-pin
FineLine BGA package.
The Altera design software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 7).
Figure 7. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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