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参数资料
型号： ES52C5E25V-20.000MTR
厂商： ECLIPTEK CORP
元件分类： XO, clock
英文描述： TCVCXO, CLIPPED SINE OUTPUT, 20 MHz
封装： ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
文件页数： 1/6页
文件大小： 175K
代理商： ES52C5E25V-20.000MTR
Pb
RoHS
ES52C5E25V-20.000M TR
ES52C5 E 25 V -20.000M TR
Series
RoHS Compliant (Pb-free) 3.0V 3.2mm x 5mm Ceramic
SMD Clipped Sinewave TC(VC)XO
Operating Temperature Range
-30°C to +75°C
Frequency Stability
±2.5ppm Maximum
Packaging Options
Tape & Reel
Nominal Frequency
20.000MHz
Control Voltage
1.5Vdc ±1.0Vdc
ELECTRICAL SPECIFICATIONS
Nominal Frequency
20.000MHz
Frequency Stability vs. Frequency
Tolerance
±1.0ppm Maximum (at 25°C ±2°C, at Vdd=3.0Vdc, and Vc=1.5Vdc)
Frequency Stability
±2.5ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=3.0Vdc and Vc=1.5Vdc)
Frequency Stability vs. Input Voltage
±0.3ppm Maximum (±5%)
Frequency Stability vs. Aging
±1ppm/year Maximum (at 25°C)
Frequency Stability vs. Load
±0.2ppm Maximum (±1kOhm//±1pF)
Operating Temperature Range
-30°C to +75°C
Supply Voltage
+3.0Vdc ±5%
Input Current
2.0mA Maximum
Output Voltage
0.7Vp-p Clipped Sinewave Minimum (External DC-Cut capacitor required, 1000pF recommended)
Load Drive Capability
10kOhms//10pF
Output Logic Type
Clipped Sinewave
Control Voltage
1.5Vdc ±1.0Vdc
Frequency Deviation
±8ppm Minimum
Transfer Function
Positive Transfer Characteristic
Phase Noise
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at
10kHz Offset (Typical Values at 12.800MHz)
Start Up Time
5mSec Maximum
Storage Temperature Range
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 3/13/2011 | Page 1 of 6
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