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参数资料
| 型号： | ES52K1C05N-20.000MTR |
| 厂商： | ECLIPTEK CORP |
| 元件分类： | TCXO, sine |
| 英文描述： | TCXO, CLIPPED SINE OUTPUT, 20 MHz |
| 封装： | ROHS COMPLIANT, CERAMIC, SMD, 4 PIN |
| 文件页数： | 1/5页 |
| 文件大小： | 157K |
| 代理商： | ES52K1C05N-20.000MTR |
Pb
RoHS
ES52K1C05N-20.000M TR
ES52K1 C 05 N -20.000M TR
Series
RoHS Compliant (Pb-free) 3.0V 2.5mm x 3.2mm
Ceramic SMD Clipped Sinewave TC(VC)XO
Operating Temperature Range
-20°C to +70°C
Frequency Stability
±0.5ppm Maximum
Packaging Options
Tape & Reel
Nominal Frequency
20.000MHz
Control Voltage
None (No Connect on Pad 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
20.000MHz
Frequency Stability vs. Frequency
Tolerance
±0.5ppm Maximum (at 25°C ±2°C, at Vdd=3.0Vdc, and Vc=1.5Vdc)
Frequency Stability
±0.5ppm Maximum (Inclusive of Operating Temperature Range, At Vdd=3.0Vdc and Vc=1.5Vdc)
Frequency Stability vs. Input Voltage
±0.2ppm Maximum (±5%)
Frequency Stability vs. Aging
±1ppm/year Maximum (at 25°C)
Frequency Stability vs. Load
±0.2ppm Maximum (±1kOhm//±1pF)
Operating Temperature Range
-20°C to +70°C
Supply Voltage
+3.0Vdc ±5%
Input Current
2.0mA Maximum
Output Voltage
0.8Vp-p Clipped Sinewave Minimum (External DC-Cut capacitor required, 1000pF recommended)
Load Drive Capability
10kOhms//10pF
Output Logic Type
Clipped Sinewave
Control Voltage
None (No Connect on Pad 1)
Phase Noise
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at
10kHz Offset (Typical Values at 16.368MHz)
Start Up Time
5mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
Gross Leak Test
MIL-STD-883, Method 1014 Condition C
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 5
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