参数资料
型号: ESD11L5.0DT5G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: TVS ESD UNIDIRECT 150MW SOT-1123
产品变化通告: Wire Bond Change 01/Dec/2010
标准包装: 8,000
电压 - 反向隔离(标准值): 5V
电压 - 击穿: 5.4V
电极标记: 2 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: SOT-1123
供应商设备封装: SOT-1123
包装: 带卷 (TR)
ESD11L5.0DT5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra ? Low
Capacitance
The ESD11L5.0DT5G is designed to protect voltage sensitive
components from damage due to ESD in applications that require ultra
low capacitance to preserve signal integrity. Excellent clamping
http://onsemi.com
capability, low leakage and fast response time are combined with an
ultra low diode capacitance of 0.5 pF to provide best in class
protection from IC damage due to ESD. The ultra small SOT ? 1123
package is ideal for designs where board space is at a premium. The
PIN 1. CATHODE
2. CATHODE
3. ANODE
1
2
3
ESD11L5.0DT5G can be used to protect two uni ? directional lines or
one bi ? directional line. When used to protect one bi ? directional line,
the effective capacitance is 0.25 pF. Because of its low capacitance, it
is well suited for protecting high frequency signal lines such as
USB2.0 high speed and antenna line applications.
Specification Features:
? Low Capacitance 0.5 pF Typical
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039” x 0.024” (1.0 mm x 0.6 mm)
? Low Body Height: 0.015 ″ (0.37 mm)
? Stand ? off Voltage: 5 V
? Low Leakage
? Response Time is Typically < 1.0 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? This is a Pb ? Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
SOT ? 1123
CASE 524AA
MARKING DIAGRAM
6M
6 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping ?
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
ESD11L5.0DT5G
SOT ? 1123
(Pb ? Free)
8000/Tape & Reel
Table 1. MAXIMUM RATINGS
Rating
IEC 61000 ? 4 ? 2 (ESD) Contact
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
Symbol
° P D °
T stg
T J
T L
Value
± 10
150
? 55 to +150
? 55 to +125
260
Unit
kV
mW
° C
° C
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 3
1
Publication Order Number:
ESD11L5.0D/D
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