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| 型号： | ESD5V3U1U-02LS E6327 |
| 厂商： | Infineon Technologies |
| 文件页数： | 3/21页 |
| 文件大小： | 0K |
| 描述： | DIODE TVS 5.3V TSSLP-2-1 |
| 产品目录绘图： | ESD5V3U Circuit |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 5.3V |
| 电压 - 击穿： | 6V |
| 电极标记： | 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 2-XFDFN |
| 供应商设备封装： | PG-TSSLP-2 |
| 包装： | 标准包装 |
| 产品目录页面： | 1622 (CN2011-ZH PDF) |
| 其它名称： | ESD5V3U1U-02LSE6327INDKR |
ESD5V3U1U Series
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2011-05-27
Trademarks of Infineon Technologies AG
AURIX?, BlueMoon?, COMNEON?, C166?, CROSSAVE?, CanPAK?, CIPOS?, CoolMOS?, CoolSET?,
CORECONTROL?, DAVE?, EasyPIM?, EconoBRIDGE?, EconoDUAL?, EconoPACK?, EconoPIM?,
EiceDRIVER?, EUPEC?, FCOS?, HITFET?, HybridPACK?, ISOFACE?, I2RF?, IsoPACK?, MIPAQ?,
ModSTACK?, my-d?, NovalithIC?, OmniTune?, OptiMOS?, ORIGA?, PROFET?, PRO-SIL?,
PRIMARION?, PrimePACK?, RASIC?, ReverSave?, SatRIC?, SIEGET?, SINDRION?, SMARTi?,
SmartLEWIS?, TEMPFET?, thinQ!?, TriCore?, TRENCHSTOP?, X-GOLD?, XMM?, X-PMU?,
XPOSYS?.
Other Trademarks
Advance Design System? (ADS) of Agilent Technologies, AMBA?, ARM?, MULTI-ICE?, PRIMECELL?,
REALVIEW?, THUMB? of ARM Limited, UK. AUTOSAR? is licensed by AUTOSAR development partnership.
Bluetooth? of Bluetooth SIG Inc. CAT-iq? of DECT Forum. COLOSSUS?, FirstGPS? of Trimble Navigation
Ltd. EMV? of EMVCo, LLC (Visa Holdings Inc.). EPCOS? of Epcos AG. FLEXGO? of Microsoft Corporation.
FlexRay? is licensed by FlexRay Consortium. HYPERTERMINAL? of Hilgraeve Incorporated. IEC? of
Commission Electrotechnique Internationale. IrDA? of Infrared Data Association Corporation. ISO? of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB? of MathWorks, Inc. MAXIM? of
Maxim Integrated Products, Inc. MICROTEC?, NUCLEUS? of Mentor Graphics Corporation. Mifare? of NXP.
MIPI? of MIPI Alliance, Inc. MIPS? of MIPS Technologies, Inc., USA. muRata? of MURATA
MANUFACTURING CO., MICROWAVE OFFICE? (MWO) of Applied Wave Research Inc., OmniVision? of
OmniVision Technologies, Inc. Openwave? Openwave Systems Inc. RED HAT? Red Hat, Inc. RFMD? RF
Micro Devices, Inc. SIRIUS? of Sirius Sattelite Radio Inc. SOLARIS? of Sun Microsystems, Inc. SPANSION?
of Spansion LLC Ltd. Symbian? of Symbian Software Limited. TAIYO YUDEN? of Taiyo Yuden Co.
TEAKLITE? of CEVA, Inc. TEKTRONIX? of Tektronix Inc. TOKO? of TOKO KABUSHIKI KAISHA TA. UNIX?
of X/Open Company Limited. VERILOG?, PALLADIUM? of Cadence Design Systems, Inc. VLYNQ? of Texas
Instruments Incorporated. VXWORKS?, WIND RIVER? of WIND RIVER SYSTEMS, INC. ZETEX? of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Final Data Sheet
3
Revision 1.0, 2011-05-27
相关PDF资料 |
PDF描述 |
|---|---|
| ESD5V3U2U-03LRH E6327 | DIODE ESD ARRAY 5.3V TSLP-3-7 |
| ESD5V3U4U-HDMI E6327 | DIODE ESD ARRAY 5.3V TSLP-9 |
| ESD5V5U5ULC E6327 | DIODE TVS UNIDIR 5.5V SC74-6 |
| ESD5Z7.0T1 | TVS ESD ASD 200W 7.0V SOD-523 |
| ESD6100 | TVS DIODE 5.5V 2CH BI 4-WLCSP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ESD5V3U1U02LSE6327XTSA1 | 制造商:Infineon Technologies AG 功能描述:ESD Suppressor TVS 20KV 2-Pin TSSLP 制造商:Infineon Technologies AG 功能描述:TVS DIODES - Tape and Reel 制造商:Infineon Technologies AG 功能描述:DIODE TVS 5.3V TSSLP-2-1 |
| ESD5V3U2U | 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Ultra-Low Capacitance ESD Diode Array |
| ESD5V3U2U-03F | 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Ultra-Low Capacitance ESD Diode Array |
| ESD5V3U2U-03F E6327 | 功能描述:TVS二极管阵列 Ultra Low Capac. 5.3 V RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| ESD5V3U2U-03F H6327 | 功能描述:TVS二极管阵列 AF SCHOTTKY DIODE RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
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