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参数资料
| 型号： | ESD7M5.0DT5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | TVS ESD ULT LOW CAP SOT-723 |
| 产品变化通告： | Wire Bond Change 01/Dec/2010 |
| 标准包装： | 8,000 |
| 电压 - 反向隔离（标准值）： | 5V |
| 电压 - 击穿： | 5.4V |
| 电极标记： | 2 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-723 |
| 供应商设备封装： | SOT-723 |
| 包装： | 带卷 (TR) |
ESD7M5.0DT5G
PACKAGE DIMENSIONS
SOT ? 723
CASE 631AA
ISSUE D
2X
b1
e
? X ?
D
E
1 2
TOP VIEW
1
3 ? Y ?
2X b
0.08 X Y
3X L
A
C
SIDE VIEW
H E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.45 0.50 0.55
b 0.15 0.21 0.27
b1 0.25 0.31 0.37
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e 0.40 BSC
H E 1.15 1.20 1.25
L 0.29 REF
L2 0.15 0.20 0.25
3X
L2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.40
2X
0.27
PACKAGE
OUTLINE
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD7M5.0D/D
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