参数资料
| 型号： | ESD9L5.0ST5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | TVS ESD PROT ULT LOW CAP SOD-923 |
| 产品变化通告： | Wire Bond Change 01/Dec/2010 |
| 标准包装： | 10 |
| 电压 - 反向隔离（标准值）： | 5V |
| 电压 - 击穿： | 5.4V |
| 电极标记： | 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOD-923 |
| 供应商设备封装： | SOD-923 |
| 包装： | 标准包装 |
| 产品目录页面： | 2380 (CN2011-ZH PDF) |
| 其它名称： | ESD9L5.0ST5GOSDKR |
ESD9L, SESD9L Series
PACKAGE DIMENSIONS
SOD ? 923
CASE 514AB
ISSUE B
D
? X ?
b
1
2X
E
2
0.08 (0.0032) X Y
? Y ?
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MILLIMETERS INCHES
c
H E
A
L
DIM
A
b
c
D
E
H E
L
MIN NOM MAX
0.34 0.37 0.40
0.15 0.20 0.25
0.07 0.12 0.17
0.75 0.80 0.85
0.55 0.60 0.65
0.95 1.00 1.05
0.05 0.10 0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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For additional information, please contact your local
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ESD9L/D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ESD9M5.0ST5G | 功能描述:TVS 二极管 - 瞬态电压抑制器 ESD PROT UNI SOD923 RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C |
| ESD9P5.0ST5G | 功能描述:TVS 二极管 - 瞬态电压抑制器 UNIDIR LO CAP ESD DIODE RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C |
| ESD9R3.3ST5G | 功能描述:TVS 二极管 - 瞬态电压抑制器 ESD PROT UNI SOD923 RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C |
| ESD9R3.3ST5G | 制造商:ON Semiconductor 功能描述:TVS-DIODE 150mW 7.8V SOD-923 制造商:ON Semiconductor 功能描述:TVS-DIODE, 150mW, 7.8V, SOD-923 |
| ESD9X/BX.ST5G | 制造商:ON 功能描述:ESD Protection Diode, SOD-923 |
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