参数资料
型号: ESD9R3.3ST5G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: TVS ESD ULT LOW CAP SOD-923
产品变化通告: Wire Bond Change 01/Dec/2010
标准包装: 1
电压 - 反向隔离(标准值): 3.3V
电压 - 击穿: 4.8V
电极标记: 单向
安装类型: 表面贴装
封装/外壳: SOD-923
供应商设备封装: SOD-923
包装: 标准包装
其它名称: ESD9R3.3ST5GOSDKR
ESD9R3.3S, SZESD9R3.3S
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra ? Low
Leakage
The ESD9R is designed to provide ESD protection for ASSPs and
ASICs used in ultra low current applications such as human body sensors.
These devices have been designed for leakage under 1 nA from 0 ° C to
50 ° C when turned off. During an ESD event, these devices turn on to
clamp the ESD to a safe voltage level for the IC. These devices have the
added benefits of low capacitance for high speed data lines and small
package size for space constrained designs.
Specification Features:
? Ultra ? Low Leakage < 1 nA
? Ultra ? Low Capacitance 0.5 pF
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039 ″ x 0.024 ″ (1.00 mm x 0.60 mm)
? Low Body Height: 0.016 ″ (0.4 mm)
? Stand ? off Voltage: 3.3 V
? Response Time < 1.0 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
? This is a Pb ? Free and Halogen ? Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
http://onsemi.com
SOD ? 923
CASE 514AB
MARKING DIAGRAM
JM
J = Specific Device Code
M = Date Code
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Device
ESD9R3.3ST5G
SZESD9R3.3ST5G
Package
SOD ? 923
(Pb ? Free)
SOD ? 923
(Pb ? Free)
Shipping ?
8000 / Tape &
Reel
8000 / Tape &
Reel
Rating
IEC 61000 ? 4 ? 2 (ESD)
HBM
Contact
Air
Symbol
Value
± 10
± 15
± 16
Unit
kV
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
° P D °
T stg
T J
T L
150
? 55 to +150
? 55 to +125
260
mW
° C
° C
° C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
May, 2013 ? Rev. 1
1
Publication Order Number:
ESD9R3.3S/D
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ESD9X5.0ST5G 功能描述:TVS 二极管 - 瞬态电压抑制器 SOD-923 ESD PROT RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C