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参数资料
| 型号： | EVK105CH0R4BW-F |
| 厂商： | Taiyo Yuden |
| 文件页数： | 13/21页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.4PF 16V C0H 0402 |
| 标准包装： | 10,000 |
| 系列： | EVK |
| 电容： | 0.40pF |
| 电压 - 额定： | 16V |
| 容差： | ±0.1pF |
| 温度系数： | C0H |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | RF，微波，高频 |
| 封装/外壳： | 0402（1005 公制） |
| 尺寸/尺寸： | 0.039" L x 0.020" W（1.00mm x 0.50mm） |
| 厚度（最大）： | 0.020"（0.52mm） |
| 特点： | 高 Q 值，低损耗 |
| 包装： | 带卷 (TR) |
（C－C 2 ）
C 2
×100（%）
C ：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
9. Deflection
Temperature
Standard
Appearance
Capacitance change
: No abnormality
: Within ±5% or ±0.5 pF, whichever is larger.
Specified
Compensating（Class1）
High Frequency Type
Appearance
Capacitance change
: No abnormality
: Within±0.5 pF
Value
High Permittivity （Class2）
Appearance
Capacitance change
: No abnormality
: Within ±12.5%（BJ, B7, C6, C7,LD(※)）
Within ±30%（F）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Multilayer Ceramic Capacitors
042, 063,
※
105 Type
The other types
Test
Methods and
Remarks
Board
Thickness
Warp
Duration
※
Glass epoxy-resin substrate
0.8mm 1.6mm
1mm
10 sec.
105 Type thickness, C： 0.2mm ,P： 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Specified
Value
Temperature
Compensating（Class1）
High Permittivity （Class2）
Standard
High Frequency Type
－
No mechanical damage.
－
High Frequency Type
Test
Methods and
Applied force : 5N
Duration : 10 sec.
Remarks
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No terminal separation or its indication.
High Permittivity （Class2）
Multilayer Ceramic Capacitors
Test
042, 063 Type
105 Type or more
Methods and
Remarks
12. Solderability
Applied force
Duration
2N 5N
30±5 sec.
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
At least 95% of terminal electrode is covered by new solder.
High Permittivity （Class2）
Test
Methods and
Remarks
Solder type
Solder temperature
Duration
Eutectic solder
H60A or H63A
230±5℃
4±1 sec.
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EVK105CH0R5BW-F | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP HI FREQ 0402 16V C0H 0.50.1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| EVK105CH0R6BW-F | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP HI FREQ 0402 16V C0H 0.60.1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| EVK105CH0R7BW-F | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP HI FREQ 0402 16V C0H 0.70.1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| EVK105CH0R8BW-F | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP HI FREQ 0402 16V C0H 0.80.1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| EVK105CH0R9BW-F | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP HI FREQ 0402 16V C0H 0.90.1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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