参数资料
| 型号： | EX64-TQ64I |
| 厂商： | Microsemi SoC |
| 文件页数： | 38/48页 |
| 文件大小： | 0K |
| 描述： | IC FPGA ANTIFUSE 3K 64-TQFP |
| 标准包装： | 160 |
| 系列： | EX |
| 逻辑元件/单元数： | 128 |
| 输入/输出数： | 41 |
| 门数： | 3000 |
| 电源电压： | 2.3 V ~ 2.7 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 64-LQFP |
| 供应商设备封装： | 64-TQFP（10x10） |
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Revision 10
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 10
(October 2012)
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement industry
standard security (SAR 34677).
Package names used in the "Product Profile" section and "Package Pin Assignments"
section were revised to match standards given in Package Mechanical Drawings (SAR
34779).
Revision 9
(June 2011)
The versioning system for datasheets has been changed. Datasheets are assigned a
revision number that increments each time the datasheet is revised. The "eX Device
Status" table indicates the status for each device in the device family.
The Chip Scale packages (CS49, CS128, CS181) are no longer offered for eX devices.
They have been removed from the product family information. Pin tables for CSP
packages have been removed from the datasheet (SAR 32002).
N/A
Revision 8
(v4.3, June 2006)
The "Ordering Information" was updated with RoHS information. The TQFP
measurement was also updated.
The "Dedicated Test Mode" was updated.
Note 5 was added to the "3.3 V LVTTL Electrical Specifications" and "5.0 V TTL
Electrical Specifications" tables
The "LP Low Power Pin" description was updated.
Revision 7
(v4.2, June 2004)
The "eX Timing Model" was updated.
v4.1
The "Development Tool Support" section was updated.
The "Package Thermal Characteristics" section was updated.
v4.0
The "Product Profile" section was updated.
The "Ordering Information" section was updated.
The "Temperature Grade Offerings" section is new.
The "eX FPGA Architecture and Characteristics" section was updated.
The "Clock Resources" section was updated.
The "User Security" section was updated.
The "I/O Modules" section was updated.
The "Hot-Swapping" section was updated.
The "Power Requirements" section was updated.
The "Low Power Mode" section was updated.
The "Boundary Scan Testing (BST)" section was updated.
The "Dedicated Test Mode" section was updated.
相关PDF资料 |
PDF描述 |
|---|---|
| HMM36DSAS | CONN EDGECARD 72POS R/A .156 SLD |
| A3PN250-ZVQG100I | IC FPGA NANO 250K GATES 100-VQFP |
| A3PN250-VQG100I | IC FPGA NANO 250K GATES 100-VQFP |
| AMC22DRYS-S93 | CONN EDGECARD 44POS DIP .100 SLD |
| A3PN250-VQ100I | IC FPGA NANO 250K GATES 100-VQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EX64-TQG100 | 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| EX64-TQG100A | 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| EX64-TQG100I | 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| EX64-TQG100PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:eX Family FPGAs |
| EX64-TQG64 | 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:EX 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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