参数资料
型号: EZA-ST23AAAJ
厂商: Panasonic Electronic Components
文件页数: 8/9页
文件大小: 0K
描述: RC NETWORK 47 OHM/100PF 5% SMD
产品目录绘图: EZA-ST Series Side
EZA-ST Series Top
EZA-ST Series Schematic
标准包装: 1
系列: EZAST
类型: 低通
技术: RC(Pi)
通道数: 4
电阻 - 通道 (Ohms): 47
值: R = 47 欧姆,C = 100pF
ESD 保护:
滤波器阶数: 4th
应用: 移动设备的数据线路
封装/外壳: 1608(4021 公制),凹陷
尺寸/尺寸: 0.157" L x 0.083" W(4.00mm x 2.10mm)
高度: 0.033"(0.85mm)
包装: 标准包装
工作温度: -25°C ~ 85°C
产品目录页面: 2295 (CN2011-ZH PDF)
其它名称: PST23DKR
Chip RC Networks
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for re?ow
·Re?ow soldering shall be performed a maximum of
For soldering (Example : Sn/Pb)
two times.
·Please contact us for additional information when
used in conditions other than those speci?ed.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to120 s
30 s to 40 s
max. 10 s
for solderability before actual use.
For lead-free soldering (Example : Sn/Ag/Cu)
Peak
Temperature
Time
Preheating
Heating
Preheating
Main heating
Peak
150 °C to 180 °C
Above 230 °C
max. 260 °C
60 s to 120 s
30 s to 40 s
max. 10 s
This product has circuits on both sides. Therefore, do not use
adhesives because they may impair the products characteristics.
Time
● Flow Soldering
We do not recommend ?ow soldering to the product, because solder bridging may occur due to the
narrow pitch of the terminals and the characteristics of the product may be badly affected when using
adhesive to af?x it to a circuit board.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)
so as not to damage their electrodes and protective coatings.
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity ?ux. Otherwise, the residue may impair the RC networks' performance
and/or reliability.
3. Perform suf?cient preheating so that the difference of the solder temperature and the RC networks chip surface
temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by
immersion into solvent after soldering.
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, ?nish soldering as quickly as possible (within three seconds at
350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Design and speci ?cations are each subject to change without notice. Ask factory for the current technical speci ?cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
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