参数资料
| 型号： | F1206A0R20FWTR |
| 厂商： | AVX Corporation |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | FUSE 0.20A 32V FAST THIN 1206 |
| 标准包装： | 3,000 |
| 系列： | Accu-Guard® |
| 保险丝类型： | 板安装（不包括管筒式） |
| 额定电流： | 200mA |
| 额定电压 - DC： | 32V |
| 响应时间： | 快速 |
| 封装/外壳： | 1206（3216 公制） |
| 安装类型： | 表面贴装 |
| 尺寸/尺寸： | 0.122" L x 0.063" W x 0.047" H (3.10mm x 1.60mm x 1.20mm) |
| 额定电压时的断路容量： | 50A |
| 熔化 I²t： | 0.00002 |
| 批准： | cUL，UL |
| 工作温度： | -55°C ~ 125°C |
| 包装： | 带卷 (TR) |
| DC 抗冷流： | 0.95 欧姆 |
Accu-Guard ?
SMD Thin-Film Fuse
QUALITY & RELIABILITY
Accu-Guard ? series of fuses is based on established
thin-film technology and materials used in the semiconduc-
tor industry.
? In-line Process Control: This program forms an integral
part of the production cycle and acts as a feedback sys-
tem to regulate and control production processes. The
test procedures, which are integrated into the production
process, were developed after long research and are
based on the highly developed semiconductor industry
test procedures and equipment. These measures help
AVX/Kyocera to produce a consistent and high yield line
of products.
? Final Quality Inspection: Finished parts are tested for
standard electrical parameters and visual/mechanical
characteristics. Each production lot is 100% evaluated for
electrical resistance. In addition, each production lot is
evaluated on a sample basis for:
? Insulation resistance (post fusing)
? Blow time for 2 x rated current
? Endurance test: 125°C, rated current, 4 hours
HANDLING AND SOLDERING
SMD chips should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use
of plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are
minimized. For automatic equipment, taped and reeled
product is the ideal medium for direct presentation to the
placement machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used
(e.g. FR-4, G-10).
For other circuit board materials, please consult factory.
WAVE SOLDERING
Dimensions: millimeters (inches)
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs are:
a. Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but
it is not advisable to go below this.
b. Pad overlap 0.5mm.
c. Pad extension 0.5mm for reflow. Pad extension about
1.0mm for wave soldering.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should
not exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should
be used.
REFLOW SOLDERING
Dimensions: millimeters (inches)
0402
0.8
(0.031)
2.1
(0.083) 0.5
0603
1.25
(0.049)
0805
1.5
(0.059)
0402
0.6
(0.024)
0603
0.85
(0.033)
0805
1.0
(0.039)
(0.020)
0.8
(0.031)
0.59
(0.023)
3.1
(0.122)
0.6
(0.024)
1.25
(0.049)
4.0
(0.157)
1.0
(0.039)
1.7
(0.068)
0.5
(0.020)
0.6
(0.024)
0.59
(0.023)
2.3
(0.091)
0.6
(0.024)
0.85
(0.033)
0.8
(0.031)
3.0
(0.118)
1.0
(0.039)
1.0
(0.039)
1206
5.0
(0.197)
1.5
(0.059)
2.0
(0.079)
0.8
(0.031)
0612
3.1
(0.122)
1.25
(0.049)
1.25
1.5
(0.059)
1.25
(0.049)
0.6 (0.024)
1206
4.0
(0.157)
1.0
(0.039)
2.0
(0.079)
0612
2.3
(0.091)
0.85
(0.033)
0.85
(0.033)
0.6 (0.024)
3.1
(0.122)
1.25
(0.049)
(0.049)
1.5
3.1
(0.122)
1.0
(0.039)
(0.059)
1.6
(0.063)
1.6
(0.063)
28
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相关代理商/技术参数 |
参数描述 |
|---|---|
| F1206A0R25FSTR | 功能描述:FUSE 0.25A 32V FAST THIN 1206 RoHS:是 类别:过电压，电流，温度装置 >> 保险丝 系列:Accu-Guard® 标准包装:100 系列:MSTU 250 保险丝类型:板安装（不包括管筒式） 额定电流:1.6A 额定电压 - AC:250V 额定电压 - DC:- 响应时间:慢速 封装/外壳:径向，罐状，垂直 安装类型:通孔 尺寸/尺寸:0.335" 直径 x 0.335" L（8.50mm x 8.50mm） 额定电压时的断路容量:50A 熔化 I²t:17.5 批准:CCC，cULus 工作温度:-40°C ~ 85°C 颜色:- 包装:散装 DC 抗冷流:- 其它名称:34.721734.7217-ND |
| F1206A0R25FWTR | 功能描述:保险丝 0.25A SMD RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
| F1206A0R37FWTR | 功能描述:保险丝 0.37A SMD RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
| F1206A0R50FSTR | 功能描述:FUSE 0.50A 32V FAST THIN 1206 RoHS:是 类别:过电压，电流，温度装置 >> 保险丝 系列:Accu-Guard® 标准包装:100 系列:MSTU 250 保险丝类型:板安装（不包括管筒式） 额定电流:1.6A 额定电压 - AC:250V 额定电压 - DC:- 响应时间:慢速 封装/外壳:径向，罐状，垂直 安装类型:通孔 尺寸/尺寸:0.335" 直径 x 0.335" L（8.50mm x 8.50mm） 额定电压时的断路容量:50A 熔化 I²t:17.5 批准:CCC，cULus 工作温度:-40°C ~ 85°C 颜色:- 包装:散装 DC 抗冷流:- 其它名称:34.721734.7217-ND |
| F1206A0R50FWTR | 功能描述:保险丝 0.50A SMD RoHS:否 制造商:Littelfuse 产品:Surface Mount Fuses 电流额定值:0.5 A 电压额定值:600 V 保险丝类型:Fast Acting 保险丝大小/组:Nano 尺寸:12.1 mm L x 4.5 mm W 安装风格: 端接类型:SMD/SMT 系列:485 |
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